WMSIC Electronic Components

PROD PSPHAQ127-101M PSPHAQ127

ModelPSPHAQ127-101M
PackageSMD,12x12mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPHAQ127-101M
Type
PROD
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPHAQ127-101M
Electronic Component
1
Package
SMD,12x12mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
4.632g
Inductor
100uH
Electronic Component
1
Electronic Component
BM0229259026
Current
1.7A
Resistor(DCR)
220mΩ
Electronic Component
Electronic Component
Electronic Component
500
and Current(Isat)
2.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPHAQ127-101M 产品概述

一、产品简介

PSPHAQ127-101M 是谱罗德(PROD)推出的一款表面贴装功率电感,额定电流与饱和性能针对中低功率开关电源和滤波场合优化。器件为 SMD 结构,外形尺寸 12 × 12 mm,体积小巧,便于自动贴装与回流焊加工,适合工业、通信和消费类电子的电源前端与 EMI 抑制设计。

二、主要规格与参数

  • 电感值:100 µH
  • 精度(公差):±20%
  • 额定电流(Irated):1.7 A(建议长期工作电流)
  • 饱和电流(Isat):2.2 A(直流偏置下电感显著下降前的临界值)
  • 直流电阻(DCR):约 220 mΩ
  • 封装形式:SMD,尺寸 12×12 mm
    以上参数为典型规格,实际应用中电感值会随直流偏置和温度有所变化,设计时应留有裕量。

三、性能特点

  • 大电感值:100 µH 适合用于低频滤波与能量储存,能显著抑制开关噪声和输出纹波。
  • 合理电流等级:1.7 A 的额定电流配合 2.2 A 的饱和电流,适合中等电流的降压/升压模块和后端滤波。
  • 较高 DCR:约 220 mΩ,在选择时需平衡效率与电感值,DCR 较高将导致较大的 I^2R 损耗和发热。
  • SMD 封装:12×12 mm 的标准贴片结构,利于电路板布局与热管理。

四、典型应用场景

  • 开关电源(DC-DC 降压/升压转换器)的功率电感或输出滤波电感;
  • 逆变器或电机驱动的辅助滤波电感;
  • EMI 抑制与输入端 LC 滤波;
  • 各类嵌入式设备、通信设备和工业控制器的电源模块。

五、选型与使用建议

  • 工作电流裕量:长期工作电流建议不超过额定电流 1.7 A,以减少温升并延长寿命;峰值或瞬态电流应低于 Isat 2.2 A,避免电感值大幅下降。
  • DCR 考量:若系统对效率敏感,需评估 220 mΩ 带来的损耗并考虑并联或选用更低 DCR 的型号。
  • 直流偏置影响:在高直流偏置下电感值会下降,设计时应测量或参考厂商直流偏置特性曲线来确认实际电感值。
  • 热管理:靠近发热器件应有热导铜层或热铜箔,必要时增加通孔或散热铜箔以降低结温。

六、封装与焊接建议

  • 推荐采用标准回流焊工艺,遵循元件厂家给出的焊接温度曲线。
  • PCB 布局:电感底部和附近应留足焊盘面积以保证良好热导与机械强度;开关节点布线尽量短且粗,减小回路面积以降低 EMI。
  • 若需改善散热,可在电感附近设计热过孔连接到下层铜箔。

七、可靠性与注意事项

  • 使用前确认电路最大峰值电流和温度环境,必要时进行热仿真或实测验证;
  • 避免长期在额定电流附近运行,以防温升导致参数漂移或失效;
  • 对于关键应用,建议向供应商索取样品并进行实际电流、温升及频率响应测试。

如需更详细的电流-电感特性曲线、温升数据或推荐封装焊盘图,请联系供应商或索取器件详尽数据手册。

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