WMSIC Electronic Components

PROD PSPMAA0603-2R2M-ANF PSPMAA0603

ModelPSPMAA0603-2R2M-ANF
PackageSMD,6.6x7.1x3mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PSPMAA0603-2R2M-ANF
Type
PROD
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PSPMAA0603-2R2M-ANF
Electronic Component
1
Package
SMD,6.6x7.1x3mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.1g
Inductor
2.2uH
Electronic Component
1
Electronic Component
BM0257711549
Current
8A
Resistor(DCR)
20mΩ
Electronic Component
Electronic Component
Electronic Component
1000
and Current(Isat)
14A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSPMAA0603-2R2M-ANF 产品概述

一、产品简介

PSPMAA0603-2R2M-ANF 是谱罗德(PROD)推出的一款功率型表面贴装电感,额定电感值 2.2 μH(±20%),面向大电流开关电源和点载(point-of-load)电源模块应用。封装为 SMD,外形尺寸 6.6 × 7.1 × 3.0 mm,结构紧凑,适合对体积与电流能力都有要求的电源设计。

二、主要参数

  • 电感值:2.2 μH ±20%
  • 额定电流(Ir):8 A(连续工作建议值)
  • 饱和电流(Isat):14 A(在大直流偏置下电感显著下降的参考值)
  • 直流电阻(DCR):20 mΩ
  • 封装:SMD,6.6 × 7.1 × 3.0 mm
  • 品牌:PROD(谱罗德)

三、特性与优势

  • 大电流承载能力:额定 8A、饱和 14A,适合中高功率降压(Buck)以及点载供电场合。
  • 紧凑尺寸:6.6×7.1 mm 的 SMD 封装便于高密度 PCB 布局。
  • 低 DCR:20 mΩ 有利于降低 I²R 损耗并减小温升(但在高电流下仍需注意功耗)。
  • 工艺可靠:适配常见回流焊工艺,便于自动化生产。

四、典型应用场景

  • DC-DC 降压转换器和点载模块(服务器、通信电源、工业控制)
  • LED 驱动电源与电机驱动前级滤波
  • 高功率电源管理、充电器与电源模块滤波器

五、选型与注意事项

  • 额定与饱和电流:设计时应以额定电流 8A 为长期工作参考,避免长期接近 Isat 运行以免电感衰减或产生过大温升。
  • 损耗估算:按 DCR 计算直流损耗 P = I²·DCR,例如在 8A 时 P ≈ 1.28 W,需考虑散热与温升影响,若效率要求高可选更低 DCR 或并联器件。
  • 电感容差 ±20%:对电路工作频率与纹波电流敏感时,应在仿真/实验中验证最差容差下的性能。
  • 温度与老化:在高温环境下电感值可能发生漂移,必要时请咨询厂方获取详细温度系数和寿命数据。

六、PCB 布局与焊接建议

  • 将电感置于开关节点附近,尽量缩短与开关管及输出电容的回路长度,减小电磁干扰与回路阻抗。
  • 使用足够铜厚与宽焊盘以承载大电流,必要时在焊盘下加多热铺/过孔以增强散热。
  • 遵循元件厂商回流焊建议(常见回流峰值 ≤ 260°C),避免超温或长时间热暴露。

七、可靠性与测试建议

  • 建议进行热循环、湿热以及大电流老化测试以验证在目标工况下的寿命和温升。
  • 对 EMI、纹波与效率进行系统级验证,确认在最差电感容差和最大纹波电流下仍满足要求。

总结:PSPMAA0603-2R2M-ANF 以其 2.2 μH/8A 的额定能力与小体积封装,适合中高功率密度电源设计。选用时应重视 DCR 带来的功耗与温升,并在 PCB 布局和散热设计上做优化,以保证长期可靠运行。若需更详细的电气特性曲线或封装焊盘建议,请联系谱罗德技术支持获取官方数据手册。

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