WMSIC Electronic Components

PROD PDMTAT068125-100MLU PDMTAT068125

ModelPDMTAT068125-100MLU
PackageThrough-hole, 23x12mm
BrandPROD
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PROD PDMTAT068125-100MLU
Type
PROD
Minimum package
100 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PROD
Electronic Component
PDMTAT068125-100MLU
Electronic Component
1
Package
Through-hole, 23x12mm
Type
Inductor
Electronic Component
Color Ring / Through-hole Inductor
Electronic Component
±20%
Electronic Component
1.3mm
Electronic Component
10.1g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0228679687
Current
18A
Resistor(DCR)
5mΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PDMTAT068125-100MLU 产品概述

一、主要参数与标识

PDMTAT068125-100MLU(品牌:PROD/谱罗德)为插件环型电感,主要参数如下:

  • 电感值:10 μH,公差 ±20%
  • 额定电流:18 A(连续电流能力)
  • 直流电阻(DCR):约 5 mΩ
  • 线径:1.3 mm(实心或粗漆包线,适合大电流)
  • 封装形式:插件(色环标识),外形尺寸约 23 × 12 mm
    该型号以色环标识便于现场识别,适用于高电流电源电路的磁性元件需求。

二、产品特点

  1. 高电流容量:18 A 额定电流与 1.3 mm 粗线设计,适合大电流开关电源与降压模块使用。
  2. 低损耗:5 mΩ 低直流电阻显著降低 I²R 损耗,有助于提高系统效率并减小热量产生。
  3. 环型结构:环形磁芯提供封闭磁路,漏磁小、抗电磁干扰能力强,适用于对 EMI 要求较高的场合。
  4. 插件安装:便于手工或波峰焊装配,色环标识简化装配与检验流程。
  5. 紧凑尺寸:23×12 mm 体积在保证电流能力的同时占板面积小,便于紧凑电源设计。

三、电气与热性能分析

  • 损耗估算:在满额定电流 18 A 时,直流损耗约 P = I²·R = 18² × 0.005 ≈ 1.62 W。该功率将转化为绕组及磁芯发热,应在设计时考虑散热或采用电流容许度降低(需留有安全裕量)。
  • 温升与散热:建议在有良好空气对流或贴近散热铜箔的PCB布局中使用;对长期连续满载工况建议留出散热空间或采取强制风冷。
  • 环境与测试:电感公差为 ±20%,出厂一般在标准测试条件(厂家规定频率与电流)下测量并标注。对关键电路建议在应用频率与工作电流条件下进行实际测量验证。

四、典型应用场景

  • 开关电源(降压/升压)电感(尤其是高电流同步整流或多通道供电模块)
  • 输入滤波与输出滤波,用于降低纹波与抑制电源干扰
  • LED 驱动电源、DCDC 电源模块、通信与基站电源、工业控制电源等需要稳健大电流磁性元件的领域

五、安装与使用注意事项

  • 焊接建议:推荐按照PCB工艺规范进行波峰焊或手工焊接;手工焊时注意避免长期高温直焊绕组端,防止绝缘漆皮损伤(一般控制焊接峰值温度与时间)。
  • 布局建议:尽量将电感与相关开关器件(MOSFET、肖特基二极管、电容)按电流回路最短路径布局,减少寄生电感并改善散热。
  • 额定与裕度:为延长寿命并降低温升,建议设计时考虑适当电流裕度(例如预计连续工况下不长期满载),并留意电感在高频工况下的表现。
  • 绝缘与安全:插件端子与周边器件保持必要间距,满足电气安全与耐压要求。

六、质量检测与订购信息

  • 出厂检测通常包含电感值、DCR、耐温及外观检验;可根据客户需求提供更多环境/寿命测试报告。
  • 订购时请注明型号 PDMTAT068125-100MLU、数量与是否需要特定筛选(例如低 DCR 批次或额外老化测试),并确认包装方式(卷装/盘装/散装)与交货期。

如需更详细的频率特性曲线、饱和电流、温升曲线或样品测试数据,可提供电路工况(工作电流、开关频率、占空比、工作温度),以便进行更精确的性能评估与匹配建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.