WMSIC Electronic Components

PSA FV21N101J102ECG

ModelFV21N101J102ECG
Package0805
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FV21N101J102ECG
Type
PSA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FV21N101J102ECG
Electronic Component
1
Electronic Component
100pF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.033g
Electronic Component
1
Electronic Component
BM0264820218
Electronic Component
C0G
Voltage
1kV
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FV21N101J102ECG 贴片陶瓷电容(MLCC)产品概述

一、产品基本身份与核心定位

FV21N101J102ECG是PSA信昌电陶推出的一款中高压贴片多层陶瓷电容(MLCC),采用0805英制封装(对应公制2012尺寸,2.0mm×1.2mm),专为对容值稳定性、耐压能力有较高要求的电路设计。产品兼顾小型化与高性能,可覆盖工业控制、射频通信、电源滤波等多领域应用,是替代传统插件电容、适配SMT自动化生产的优选方案。

二、关键参数详细解析

该产品的核心参数围绕“稳定、耐压、精准”三大特点展开,具体如下:

  1. 容值与精度:标称容值为100pF,精度等级为**±5%**(型号中“J”标识对应此精度),容值一致性满足工业级电路对参数偏差的要求,无需额外筛选即可批量使用;
  2. 额定电压:直流额定电压为1kV(1000V),属于中高压MLCC范畴,可支撑高电压场景下的长期稳定工作,避免击穿风险;
  3. 温度系数:采用C0G(NP0) 温度系数,容值随温度变化极小(典型值±30ppm/℃以内),且受电压、频率影响可忽略,是高频、高精度电路的理想选择;
  4. 封装尺寸:0805封装(英制),体积紧凑,可有效缩小PCB布局面积,适配便携设备、高密度模块的小型化设计需求。

三、产品核心特性优势

相比普通MLCC,FV21N101J102ECG的优势集中在稳定性与耐压适配性:

  1. 极优温度稳定性:C0G系数确保容值在-55℃~125℃宽温范围内几乎无漂移,适合户外、工业等温度波动大的场景;
  2. 可靠中高压能力:1kV额定电压结合陶瓷介质的绝缘特性,可满足开关电源高压滤波、高压信号耦合等需求;
  3. 小型化设计兼容:0805封装兼容常规SMT生产线,焊接工艺成熟,可与其他贴片元件协同布局;
  4. 品牌质量保障:PSA信昌电陶作为专业MLCC制造商,产品经过严格的可靠性测试(如高温老化、湿度循环),一致性与寿命表现优异;
  5. 环保合规:符合RoHS 2.0、REACH等环保法规,无铅无镉,适配绿色制造要求。

四、典型应用场景

该产品可广泛应用于以下领域:

  1. 电源电路:开关电源的高压滤波、EMI抑制电路,减少电压波动对后级电路的影响;
  2. 射频/微波电路:基站、路由器等设备的信号耦合、匹配网络,利用C0G的稳定性保证信号传输质量;
  3. 工业控制:高压传感器、PLC模块的信号隔离与滤波,应对工业环境的温度与电压变化;
  4. 医疗设备:小型化医疗仪器(如监护仪、输液泵)的信号处理电路,需稳定容值与高耐压;
  5. 通信终端:智能手机、平板等便携设备的高频模块(如WiFi、蓝牙)的匹配电容。

五、选型与使用注意事项

为确保产品性能与寿命,需注意以下要点:

  1. 电压降额:中高压应用建议降额50%以上(实际工作电压≤500V DC),避免长期高压导致介质老化;
  2. 焊接工艺:优先采用回流焊,焊接温度曲线需符合MLCC要求(峰值温度≤245℃,时间≤10s),避免手工焊过热损坏陶瓷层;
  3. 频率适配:C0G介质适合高频(可达GHz级),若用于低频电路需确认容值是否匹配;
  4. 存储条件:未开封产品建议存储在温度0℃~40℃、湿度≤60%的环境中,避免受潮影响焊接性能。

六、总结

FV21N101J102ECG作为PSA信昌电陶的高性价比中高压MLCC,凭借C0G温度稳定性、1kV耐压与0805小型化封装,精准匹配电源、射频、工业等多领域的高性能需求。产品兼顾可靠性与环保性,是电路设计中替代传统电容、提升集成度的可靠选择。

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