Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM21N472J101ECG是PSA信昌电陶推出的一款0805封装多层陶瓷贴片电容(MLCC),专为需要高精度、低损耗、温度稳定的电子电路设计,核心参数覆盖4.7nF容值、±5%精度、100V额定电压及C0G温度系数,广泛适配射频、高速数字、精密模拟等场景。
该型号的关键参数可通过型号编码与公开规格明确,具体如下:
参数项 规格值 编码含义说明 标称容值 4.7nF(472) 47×10²pF=4.7nF 容值精度 ±5%(J) EIA精度代码J对应±5% 额定电压(DC) 100V(101) 10×10¹V=100V 温度系数 C0G(NP0类) 温度补偿型,低漂移 封装尺寸 0805(英制) 2.0mm×1.25mm(公制) 工作温度范围 -55℃~125℃ 符合工业级温度要求 环保标准 RoHS 2.0、REACH 无铅无卤,绿色环保注:C0G与行业常用的“NP0”为等效温度系数,均指容值随温度、电压变化极小的陶瓷介质。
0805封装是电子行业应用最广泛的贴片封装之一,FM21N472J101ECG的封装特性如下:
作为C0G介质MLCC,FM21N472J101ECG的电气性能核心优势在于高稳定性、低损耗:
PSA信昌电陶采用多层陶瓷叠层工艺制造该产品,材料与可靠性经过严格测试:
FM21N472J101ECG因高稳定性与低损耗,广泛应用于以下领域:
综上,FM21N472J101ECG是一款性能稳定、适配性强的C0G介质MLCC,可满足精密电子设备对高稳定性电容的需求,是射频、高速数字、工业控制等领域的优选方案。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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