WMSIC Electronic Components

PSA FM32X223K251EMG

ModelFM32X223K251EMG
Package1210
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FM32X223K251EMG
Type
PSA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FM32X223K251EMG
Electronic Component
1
Electronic Component
22nF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.066g
Electronic Component
1
Electronic Component
BM0265675307
Electronic Component
X7R
Voltage
250V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FM32X223K251EMG 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本信息

FM32X223K251EMG是信昌电陶(PSA) 推出的中高压贴片多层陶瓷电容(MLCC),属于工业级宽温稳定型器件。型号编码清晰对应核心参数:

  • “223”=22nF(容值,22×10³pF);
  • “251”=250V(直流额定电压);
  • “X7R”=介电材质代码;
  • “1210”=英制贴片封装规格。
    该产品兼顾高容值密度、宽温稳定性与中高压适配性,广泛应用于工业、汽车、电源等领域。

二、核心电气性能参数

产品核心参数明确,适配中高压电路需求:

  1. 容值与精度:标称容值22nF,精度±10%,满足大多数工业/消费类电路对容值偏差的要求;
  2. 额定电压:直流额定电压250V,短时间可承受峰值电压(需遵循降额规范),适配中高压电源、滤波电路;
  3. 介电特性:采用X7R高介电常数陶瓷材质,容值密度是NPO材质的5~10倍,同时避免Y5V材质的大幅温漂问题。

三、封装与物理特性

采用1210英制贴片封装,对应公制尺寸约3.0mm(长)×2.5mm(宽),封装厚度约1.0~1.2mm(依批次略有差异),具有以下优势:

  1. SMT适配性:无引线设计,兼容常规回流焊/波峰焊工艺,焊接可靠性高;
  2. 高密度布局:小尺寸适配紧凑型PCB,适合小型化电子设备(如车载模块、智能家电);
  3. 机械可靠性:陶瓷基体+金属电极结构,耐机械应力(如振动、冲击)性能优于电解电容。

四、温度特性与稳定性

X7R材质赋予产品优异的宽温性能:

  1. 工作温度范围:-55℃+125℃,覆盖工业级(-40+85℃)、汽车级(-40~+125℃)等场景;
  2. 容值温漂控制:全温度范围内容值变化率≤±15%(行业标准),避免温度波动导致电路性能漂移;
  3. 长期稳定性:陶瓷材质无电解液干涸问题,使用寿命远超铝电解电容,适合7×24小时运行设备。

五、典型应用场景

结合电气与物理特性,该产品主要应用于:

  1. 工业控制:PLC、变频器的电源滤波、信号耦合电路,应对工业环境的宽温与电磁干扰;
  2. 开关电源:中高压开关电源的输出滤波、EMI抑制,降低纹波与噪声;
  3. 汽车电子:车载电源模块、传感器接口(如温度/压力传感器耦合),满足汽车级可靠性要求;
  4. 通信设备:基站、路由器的射频旁路、耦合电路,提升信号传输稳定性;
  5. 高端消费电子:智能家居设备、高端家电的电源滤波,兼顾性能与成本。

六、选型与使用注意事项

  1. 电压降额:实际工作电压建议不超过额定电压的80%(≤200V),避免过压损坏;
  2. 焊接规范:回流焊峰值温度控制在230~250℃,时间≤10s,防止陶瓷开裂;
  3. 存储条件:常温干燥环境存储(湿度≤60%),避免受潮影响焊接性能;
  4. 批量保障:信昌电陶(PSA)作为专业MLCC制造商,产品一致性经行业验证,适合批量采购。

该产品通过平衡性能、成本与可靠性,成为中高压宽温MLCC的高性价比选型。

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