WMSIC Electronic Components

PSA FV32X683K102EGG

ModelFV32X683K102EGG
Package1210
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FV32X683K102EGG
Type
PSA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FV32X683K102EGG
Electronic Component
1
Electronic Component
68nF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.156g
Electronic Component
1
Electronic Component
BM0265313013
Electronic Component
X7R
Voltage
1kV
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSA信昌电陶FV32X683K102EGG多层陶瓷电容产品概述

一、产品基本信息

FV32X683K102EGG是PSA信昌电陶推出的1210封装X7R多层陶瓷电容(MLCC),核心参数清晰明确:

  • 品牌:PSA信昌电陶(国内专业陶瓷元器件制造商,专注MLCC研发生产超20年);
  • 型号:FV32X683K102EGG;
  • 封装:1210(英制封装,对应公制尺寸3.2mm×2.5mm×1.0mm,贴片高度适配常规SMT产线);
  • 容值:68nF(标注“683”,即68×10³pF=68nF);
  • 精度:±10%(标注“K”,覆盖多数通用电路匹配需求);
  • 温度系数:X7R(行业标准宽温特性,-55℃~+125℃内容值漂移≤±15%);
  • 耐压:10V DC(型号“102”对应10V直流耐压,适配低电压电路场景);
  • 包装后缀:“EGG”代表编带卷盘包装,适配自动化贴装。

二、核心性能优势

  1. 宽温稳定可靠:X7R温度系数使产品在-55℃至+125℃范围内容值波动极小,可满足车载、工业等严苛环境(如-40℃~+85℃车载工况);
  2. 精度适配性强:±10%精度(K档)无需额外匹配补偿,覆盖滤波、耦合、去耦等通用电路场景;
  3. 小体积高密度:1210封装仅占用8mm²PCB面积,同时实现68nF高容值密度,适配便携式设备紧凑设计;
  4. 高频性能优异:MLCC固有的低ESR(等效串联电阻)、低ESL(等效串联电感)特性,可有效抑制高频噪声,提升信号完整性;
  5. 无极性易贴装:无正负极区分,贴装方向无限制,大幅提高SMT产线效率,降低出错率。

三、典型应用领域

FV32X683K102EGG因性能均衡,广泛应用于:

  1. 消费电子:智能手机、平板、笔记本的电源滤波(DC-DC转换)、音频耦合、射频去耦;
  2. 汽车电子:车载IVI(信息娱乐系统)、仪表盘、BCM(车身控制模块)的电源稳压与信号滤波;
  3. 工业控制:PLC、变频器、伺服驱动器的模拟信号滤波、数字电源去耦;
  4. 通信设备:路由器、交换机、基站RRU的射频耦合、电源模块滤波;
  5. 家电产品:智能电视、变频空调、洗衣机控制板的电源滤波与信号耦合。

四、包装与应用注意事项

  1. 包装规格:采用7"(5000个/盘)或13"(10000个/盘)编带卷盘,符合SMT自动化贴装标准;
  2. 储存条件:建议25℃±5℃、相对湿度≤60%环境储存,避免阳光直射与腐蚀性气体,储存期≤12个月;
  3. 贴装要求:回流焊峰值温度230℃~260℃,单焊点受热时间≤10秒(避免热应力开裂);焊接后需检查虚焊、桥接;
  4. 环保认证:符合RoHS 2.0、REACH法规,无铅无镉,适配全球市场环保需求。

五、质量与可靠性

PSA对该产品进行严格可靠性测试,满足工业级要求:

  • 高温寿命(HTOL):125℃、10V DC下1000小时,容值变化≤±10%,绝缘电阻≥10⁹Ω;
  • 温度循环(TC):-55℃~+125℃循环1000次,无开裂、参数漂移;
  • 湿度寿命(HAST):121℃、85%RH下96小时,性能稳定。

该产品可长期支撑电子设备稳定运行,是通用电路的高性价比选择。

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