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PSA FV55X103K302EGQ
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FV55X103K302EGQ
- Type
- PSA
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FV55X103K302EGQ
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 2220
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.528g
- Electronic Component
- 1
- Electronic Component
- BM0264906419
- Electronic Component
- X7R
- Voltage
- 3kV
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FV55X103K302EGQ 产品概述
一、产品简介
FV55X103K302EGQ 为 PSA（信昌电陶）推出的高压多层陶瓷贴片电容（MLCC），额定电压 3kV，标称电容 10nF，精度 ±10%，温度特性为 X7R，封装 2220（常用于高压与功率电路的贴片封装）。该器件适合在体积受限但需承受高电压的场合提供可靠的滤波、耦合与阻尼功能。
二、主要特性
- 额定电压：3000 V DC，适用于中高压直流场合。
- 容值与公差：10 nF，±10%（K）。
- 温度特性：X7R（-55°C 至 +125°C，典型温度范围内容值变化有限）。
- 封装：2220 MLCC 贴片封装，适合自动贴装与回流焊工艺。
- 品牌与可靠性：由 PSA（信昌电陶）制造，面向工业级应用设计与测试。
三、应用场景
- 高压电源滤波与旁路；
- 脉冲功率与阻尼网络（如开关电源吸收）；
- 测量仪器、医疗设备与工业控制系统中的高压耦合或隔离电容；
- 高频噪声抑制与射频前端的去耦（在考虑 X7R 的频率特性与电压依赖性下使用）。
四、使用与设计注意事项
- X7R 为 II 类介质，存在随温度与直流偏压而发生容值下降的特性；在高直流偏压条件下应考虑电容有效值的降额；
- 推荐按器件制造商提供的回流焊曲线进行焊接，避免过热与长时间高温暴露；
- 2220 封装体积较大，应注意焊盘设计与应力释放，避免因热循环或机械应力导致裂纹；
- 在高电压应用中应预留适当爬电距离和孔间隔以满足安全要求。
五、可靠性与测试
常规测试项目包括耐电压、绝缘电阻、容值与损耗角、热冲击与机械冲击、焊接可靠性与寿命循环测试。实际使用中建议根据应用场景做专用的加速寿命或耐压测试。
六、选型与替代建议
选择时应综合考虑电压余量、直流偏压下的容值保持、封装尺寸与布局限制。如需更稳定的容值随电压变化较小，可考虑更高等级介质或组合使用阻尼电阻/串联电容方案。订购请以完整料号 FV55X103K302EGQ 或联系 PSA（信昌电陶）渠道获取详细数据手册与出货信息。
如需该型号的详尽电气曲线（频率响应、直流偏压特性）或回流焊制造规范，我可协助整理或联系厂家资料。
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