Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PSA FM43X334K251EFG
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM43X334K251EFG
- Type
- PSA
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM43X334K251EFG
- Electronic Component
- 1
- Electronic Component
- 330nF
- Package
- 1812
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.237g
- Electronic Component
- 1
- Electronic Component
- BM0264906400
- Electronic Component
- X7R
- Voltage
- 250V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM43X334K251EFG 产品概述
一、产品简介
FM43X334K251EFG 是 PSA（信昌电陶）出品的一款贴片多层陶瓷电容（MLCC），标称电容值 330nF（334），公差 ±10%（K），额定电压 250V，介质类别 X7R，封装规格 1812（约 4.6 × 3.2 mm）。该型号面向中高电压、滤波与去耦应用，兼顾体积与电气性能。
二、主要参数
- 电容：330 nF
- 公差：±10%
- 额定电压：250 V DC
- 介质温度特性：X7R（-55°C ~ +125°C，随温度电容值有一定变化）
- 封装：1812（EIA）表贴
- 品牌：PSA（信昌电陶）
三、主要特性与优势
- 高体积比：在 1812 封装内提供较大电容值，适合空间受限但需较大电容的场合。
- 良好频率特性与低等效串联电阻（ESR），适合去耦、旁路和高频滤波。
- X7R 介质兼顾温度范围与容量密度，适用于一般工业温度范围内的稳定工作。
- 标准化封装与焊接工艺，易于自动化贴装和回流焊接。
四、典型应用
- 开关电源输入/输出滤波与旁路（250V 额定适合较高电压等级）。
- 电机驱动与逆变器辅助电路的中高压滤波。
- 功率因数校正（PFC）及整流后滤波。
- 工业控制、照明电源及消费电子中需要中等容量的高压旁路场景。
五、封装与焊接建议
- 建议采用推荐焊盘尺寸与回流焊工艺（参照厂家温度曲线，典型回流峰值温度 ≤ 260°C）。
- 焊接后应避免在电容两端施加机械应力，PCB 设计时采用适当的过孔与应力释放结构。
- 对于大电容值 MLCC，建议在焊盘设计和布线时考虑热膨胀与焊点应力，减少裂纹风险。
六、可靠性与存储
- X7R 类电容存在随温度与时间的电容漂移与介电老化，设计时应留出裕量或参照尺寸曲线修正。
- 存储环境建议干燥、避免剧烈温湿度变化，长期暴露于潮湿或污染环境可能影响焊接质量及绝缘性能。
- 具体寿命、耐压及耐候性等请参阅 PSA 官方数据表与可靠性试验报告，以获得完整规范与测试条件。
如需详细的电气曲线（频率响应、阻抗、温度特性）或回流焊、封装尺寸图及订购信息，可提供型号将为您获取并核对最新数据表。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
