WMSIC Electronic Components

PSA FV32X332K202EGG

ModelFV32X332K202EGG
Package1210
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
PSA FV32X332K202EGG
Type
PSA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FV32X332K202EGG
Electronic Component
1
Electronic Component
3.3nF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.163g
Electronic Component
1
Electronic Component
BM0264906422
Electronic Component
X7R
Voltage
2kV
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FV32X332K202EGG 产品概述

一、产品简介

FV32X332K202EGG 是 PSA(信昌电陶)推出的一款高压多层陶瓷贴片电容(MLCC),额定电压 2kV,容量 3.3nF,精度 ±10%,温度特性为 X7R。封装为 1210(公制约 3.2 × 2.5 mm),适用于需要高工作电压与稳定介电性能的中高压电子电路。

二、主要特性

  • 容值:3.3nF(332 表示)
  • 容差:±10%(K)
  • 额定电压:2kV DC,适合直流高压与脉冲应用
  • 温度系数:X7R(-55°C ~ +125°C,容量随温度变化在可接受范围内)
  • 封装:1210,适配常见贴片工艺和自动化装配
  • 类型:多层陶瓷电容(MLCC),体积小、无极性、寿命长

三、电气与环境参数

X7R 型介质提供良好的容量密度和温度稳定性,但在施加直流偏置时会产生容量下降(尤其在高电压下),建议设计时留有裕量并通过样件验证实际电容随电压的变化。该器件符合常见的无铅回流工艺要求(请参照厂方回流曲线),工作温度范围覆盖一般工业级要求,适合在-55°C 至 +125°C 环境下使用。

四、典型应用

  • 高压电源与隔离电路中的耦合/旁路与滤波
  • 脉冲电路、升压/倍压器中的能量传递与抑制纹波
  • 高压测量与传感前端的参考/去耦电容
  • 工业、电力电子和仪表等需承受千伏级电压的场合

五、封装与安装建议

1210 封装适合自动贴装与回流焊工艺。针对 2kV 等级的使用,建议注意以下事项:

  • PCB 设计时保证足够的爬电与空隙距离,遵循相关安全标准与系统要求;
  • 在高湿或污秽环境应采用适当的涂覆/绝缘处理以避免表面漏电或击穿;
  • 高压应用中建议对电容进行预装样测试,包括 DC 偏置下的容量与绝缘漏电检查;
  • 遵循厂方提供的回流温度曲线,避免过热或过快机械应力导致裂纹。

六、可靠性与质量保证

PSA(信昌电陶)拥有成熟的 MLCC 制造与质量控制体系,产品经过电气、温度循环与机械应力等常规可靠性试验。为确保长期稳定性,建议在批量使用前与供应商确认最新的规格书和样品测试结果,并在关键应用中做加速老化与失效分析验证。

备注:本文为产品概述,具体电气特性曲线、封装尺寸公差及回流工艺参数请参照厂家正式数据手册或向供应商索取技术支持。

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