Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PSA FM55N104J101EGG
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FM55N104J101EGG
- Type
- PSA
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FM55N104J101EGG
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 2220
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.6g
- Electronic Component
- 1
- Electronic Component
- BM0264906339
- Electronic Component
- C0G
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FM55N104J101EGG 产品概述
一、产品简介
FM55N104J101EGG 为 PSA（信昌电陶）出品的一款贴片多层陶瓷电容（MLCC），额定容量 100nF（0.1µF），容差 ±5%，额定直流电压 100V，温度系数 C0G（又称 NP0），封装 2220。该系列以稳定性高、损耗低著称，适合对温度漂移和频率响应有严格要求的电子系统。
二、关键电气参数
- 容值：100nF
- 精度：±5%
- 额定电压：100V DC
- 温度系数：C0G（温度特性接近零，温度范围内电容变化极小）
- 封装：2220（大型片式封装，便于大电流和低阻抗环境使用）
三、性能与特点
- 温度稳定性优异：C0G/NP0 陶瓷介质在宽温区间内几乎无介电常数变化，适合精密滤波与定时电路。
- 低损耗、高 Q 值：介质损耗小，适用于高频信号通道及射频匹配网络。
- 极低电容老化：与高介电常数材料相比，C0G 几乎不发生电容随时间的衰减，长期稳定性好。
- 耐压与可靠性：100V 额定电压满足中高压应用需求，2220 尺寸在大电流、耐浪涌场景下表现更稳健。
四、典型应用场景
- 精密模拟电路：滤波、耦合与旁路，保障 ADC/DAC 与放大器的稳定工作
- 高频与射频电路：匹配网络、去耦与谐振回路
- 时钟/定时网络：RC 定时、相位噪声要求高的振荡器
- 工业与仪表：传感器前端、测量仪器中对稳定性要求高的场合
五、封装与焊接注意事项
- 2220 封装体积较大，回流焊时应根据厂家推荐的温度曲线进行，以避免热应力造成的裂纹。
- 板上布局建议减小基板弯曲、避免贴片正下方存在过大机械应力；必要时在两端留有适当焊盘和过孔设计以改善应力分布。
- 长期储存与运输建议密封防潮包装，开盘后遵循防潮回流焊相关规范。
六、选型与替代建议
当系统需要更高介电常数以减小体积时，可考虑 X7R、X5R 等材料，但需要权衡温度漂移、老化与损耗。若工作电压低于 100V 且对体积有严格要求，可选用更小封装的相同参数品种；反之若需更高耐压，可并联或选择更高额定压的型号。
七、总结
FM55N104J101EGG（PSA，2220，100nF ±5%，100V，C0G）是一款面向高稳定性与低损耗应用的 MLCC，适合精密模拟、高频和计时类电路。其 C0G 材料和较大 2220 封装在要求温度稳定性、长期可靠性以及较高电压承受能力的场景中具有明显优势。购买与设计时请关注回流焊工艺、防潮存储和 PCB 机械应力控制，以确保器件长期稳定工作。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece Integrated Circuit for IRS20124S IRS21956S SOP-20 IRS2453DS SOP-14
- Model
- IRS20124S
- Package
