WMSIC Electronic Components

PSA FM32N333J631EGG

ModelFM32N333J631EGG
Package1210
BrandPSA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Option 157555

Availability on request

Technical data

Product details

18 specifications

Core information

Product name
PSA FM32N333J631EGG
Type
PSA
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PSA
Electronic Component
FM32N333J631EGG
Electronic Component
1
Electronic Component
33nF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.155g
Electronic Component
1
Electronic Component
BM0265666343
Electronic Component
C0G
Voltage
630V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FM32N333J631EGG 贴片多层陶瓷电容(MLCC)产品概述

一、产品核心参数总览

FM32N333J631EGG是PSA(信昌电陶)推出的高压温度稳定型MLCC,核心参数清晰可查:

  • 标称容值:33nF(代码“333”,即33×10³pF);
  • 精度等级:±5%(标识“J”,满足工业级通用精度需求);
  • 额定电压:630V DC(标识“631”,即63×10¹V);
  • 温度系数:C0G(原NP0,EIA标准温度稳定型介质);
  • 封装规格:1210英制(公制约3.2mm×2.5mm,典型厚度1.6mm);
  • 介质类型:多层陶瓷(MLCC),无极性设计。

二、关键性能特性解析

1. 宽温范围下的容值稳定性

C0G介质是MLCC中温度系数最小的类别,容值随温度变化率≤±30ppm/℃,在**-55℃~+125℃**全温区几乎无漂移,适合对容值一致性要求高的场景(如精密滤波、信号耦合)。

2. 高压耐受与低损耗

额定电压630V DC可覆盖中高压电路需求,同时C0G介质的损耗角正切值(tanδ)≤0.15%(1kHz/25℃),能量损耗极小,能有效提升电源效率。

3. 可靠性与抗环境能力

MLCC结构紧凑,抗振动性能优于电解电容;PSA对该产品的可靠性验证包括:

  • 高温存储(125℃/1000h):容值变化≤±2%,损耗变化≤±10%;
  • 温度循环(-55℃~125℃/1000次):无开路/短路,性能稳定;
  • 高压加速寿命:符合IEC 60384-14标准,MTBF≥10⁶小时。

三、典型应用场景

1. 工业电源系统

适用于开关电源的高压滤波、EMI抑制环节,630V耐压可应对电源输入/输出的瞬态高压波动,C0G稳定性保障滤波效果。

2. 医疗设备电路

如监护仪、呼吸机的高压驱动电路,满足医疗级环境对容值稳定、无电磁干扰的要求。

3. 新能源与工业控制

  • 光伏逆变器、充电桩的高压辅助电路(宽温适配户外环境);
  • PLC(可编程逻辑控制器)的信号耦合、高压信号处理(小体积适合高密度PCB布局)。

4. 通信基站电源

基站电源的浪涌抑制与高压滤波,低损耗减少电源效率损失,可靠性适配基站7×24小时运行需求。

四、封装与焊接兼容性

1210封装符合IPC标准,兼容常规贴片工艺:

  • 回流焊:峰值温度≤260℃,保温时间≤10s;
  • 波峰焊:温度≤250℃,焊接时间≤3s;
  • 无极性设计:焊接无需区分正负极,简化贴装流程。

五、品牌与品质保障

PSA(信昌电陶)是国内MLCC领域的资深厂商,拥有20余年陶瓷介质研发经验,产品覆盖消费电子、工业、医疗等多领域。FM32N333J631EGG:

  • 采用自主C0G介质配方,容值一致性强;
  • 符合ISO 9001、IATF 16949质量管理体系;
  • 通过RoHS、REACH环保认证,满足欧盟与国内环保要求。

六、应用注意事项

  1. 电压降额:实际应用建议直流电压≤504V(额定电压的80%),避免瞬态高压冲击;
  2. 存储条件:未焊接产品需存于20±5℃、湿度40%-60%环境,存储周期≤12个月;
  3. 温度限制:工作温度需控制在-55℃~+125℃,超出范围可能导致性能下降。

总结

FM32N333J631EGG凭借高压耐受、宽温稳定、低损耗等核心特性,成为工业、医疗、新能源领域中高压电路的理想选择,PSA的品质保障进一步提升了产品的可靠性与适用性。

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