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PSA FV21X103K102ECG
Configuration
1 options
Configuration
Option 157556
Availability on request
Technical data
Product details
18
specifications
Core information
- Product name
- PSA FV21X103K102ECG
- Type
- PSA
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- PSA
- Electronic Component
- FV21X103K102ECG
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Electronic Component
- BM0257411967
- Electronic Component
- X7R
- Voltage
- 1kV
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
FV21X103K102ECG 产品概述
一、概述
FV21X103K102ECG 为 PSA（信昌电陶）系列高压多层陶瓷贴片电容（MLCC），标称电容 10nF，公差 ±10%，额定电压 1kV，介质为 X7R，封装为 0805（约 2.0 × 1.25 mm）。该产品在体积小、耐压高与工艺兼容性之间取得平衡，适用于中高电压空间受限的电子系统。
二、主要特性
- 容值：10nF ±10%（标称值）
- 额定电压：1000 V DC，适合高压直流/脉冲场合
- 介质：X7R（-55°C 至 +125°C，温度范围内电容变化受控，典型允差范围内）
- 封装：0805（SMD，便于自动化贴装）
- 适配性：符合无铅回流焊工艺要求（请按厂家回流曲线控制峰值温度）
三、应用场景
- 高压电源与升压变换器（隔离级滤波、旁路）
- 高压脉冲与探测电路（耦合/去耦）
- 医疗、安防与测试测量类高压前端
- 仪表与传感器接口的高压滤波/耦合
四、设计与使用建议
- DC 偏置与电容衰减：X7R 在高直流偏置下会出现一定电容下降，尤其在接近额定电压时，请在设计时留有裕量并进行实际偏置下测量验证。
- 焊膏与贴装：推荐焊膏覆盖率 60%–80%，以减小焊接应力和开裂风险；按照厂家建议的无铅回流曲线进行焊接，避免急冷急热。
- 机械应力：贴片电容对板弯曲较敏感，布板时避免在器件两端施加过大机械应力，优化焊盘尺寸与过孔布局。
- 老化与长期稳定性：X7R 为 II 类介质，长期使用中电容会有轻微老化或漂移；若需极高稳定性请评估并考虑冗余或使用 NP0 等稳定型产品。
五、可靠性与检验
- 出厂前建议进行常温电容、绝缘电阻/泄漏、电压耐受性测试及外观检验。
- 在高压与高温工况下，建议做加速寿命与击穿裕度评估，以确保长期可靠性。
- 储存采用干燥包装，避免潮湿环境影响焊接与性能。
六、结论
FV21X103K102ECG 在 0805 小尺寸封装下提供 1kV 的耐压能力和 10nF 的电容量，适合需要节省空间但又要求较高电压耐受的应用。设计时应关注 X7R 在高偏置下的电容变化、焊接应力与长期稳定性，通过合理的裕量和装配工艺能获得稳定可靠的使用表现。若需更详细的电气特性曲线或回流曲线，请向供应商索取完整数据手册。
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