WMSIC Electronic Components

PUYA PY32F002AW15U6TR

ModelPY32F002AW15U6TR
PackageQFN-16
BrandPUYA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
PUYA PY32F002AW15U6TR
Type
PUYA
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PUYA
Electronic Component
PY32F002AW15U6TR
Electronic Component
1
Package
QFN-16
Electronic Component
MCU(MCU / MPU / SOC)
Electronic Component
0.12g
CPU
ARM Cortex-M0
Electronic Component
1
ADC
12bit
Electronic Component
BM0264678122
Operating Voltage
1.7V~5.5V
CPU
24MHz
Electronic Component
Electronic Component
Electronic Component
6000
Electronic Component
20KB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PY32F002AW15U6TR 单片机产品概述

PY32F002AW15U6TR是普冉半导体(PUYA)针对成本敏感型、低功耗小型化嵌入式场景推出的32位单片机,基于ARM Cortex-M0内核设计,兼顾性能、功耗与性价比,适合对体积、成本有严格要求的终端应用。

一、产品定位与核心优势

该型号聚焦入门级32位MCU市场,替代传统8位单片机(如51系列),核心优势体现在:

  1. 宽电压适配:1.7V~5.5V供电范围,兼容干电池、锂电池、5V直流电源,无需额外电平转换;
  2. 紧凑封装:QFN-16(3×3mm)超小尺寸,适合高密度PCB设计(如智能穿戴、小型传感器节点);
  3. 平衡存储:20KB Flash+3KB SRAM,满足小型程序(如驱动、简单算法)与数据缓存需求;
  4. 低功耗特性:Cortex-M0内核天然低功耗,睡眠模式下μA级电流,延长电池供电设备续航。

二、硬件性能参数

类别 具体参数 内核 ARM Cortex-M0(32位精简指令集) 主频 最大24MHz(支持动态降频) 存储 20KB Flash(程序存储)、3KB SRAM(数据缓存) 工作电压 1.7V~5.5V(覆盖主流供电场景) 工作温度 商业级(0℃~70℃,可选工业级扩展) 功耗 运行模式<10mA(24MHz,5V);睡眠模式<1μA

三、关键外设资源

针对小型应用场景,外设配置紧凑实用:

  1. 12位ADC:典型8通道,采样率1Msps,支持单次/连续转换,可采集温度、湿度、电压等模拟信号;
  2. 数字IO:12个GPIO(QFN-16封装),带中断、上拉/下拉电阻,支持多种驱动模式;
  3. 定时器:1个16位通用定时器(带PWM功能),用于电机调速、定时输出;
  4. 通信接口:1路UART(串口)、1路SPI(主/从)、1路I2C(主/从),支持与传感器、蓝牙模块通信;
  5. 可靠性外设:独立看门狗(WDT)、低电压检测(LVD),保障系统稳定运行。

四、典型应用场景

该型号适配以下低成本小型化场景:

  1. 小家电控制:智能台灯(亮度PWM调节)、小型加湿器(水位ADC检测)、电动牙刷(电机驱动+定时);
  2. 传感器节点:温湿度采集模块(ADC+UART传数据)、环境监测节点(电池供电,低功耗);
  3. 消费电子:小型玩具、红外遥控器(小封装+低成本);
  4. 工业辅助控制:简单电机调速、开关量检测(如小型阀门控制)。

五、封装与可靠性

  • 封装:QFN-16(3×3mm),无引脚封装,抗干扰性优于DIP,适合贴片生产;
  • 可靠性:Flash擦写次数≥10000次,数据保持≥10年;符合RoHS环保标准,满足量产要求;
  • 抗干扰:宽电压范围+内置LVD,降低电源波动对系统的影响。

六、开发支持体系

普冉提供完整开发生态,降低落地门槛:

  1. 工具链:支持Keil MDK、STM32CubeIDE(Cortex-M0兼容),搭配PY-Link调试器;
  2. 软件资源:官方SDK包含外设驱动、示例代码(如ADC采集、PWM输出);
  3. 文档支持:详细 datasheet、用户手册、低功耗设计应用笔记;
  4. 社区服务:开发者论坛、技术问答,快速解决开发问题。

总结

PY32F002AW15U6TR以Cortex-M0内核的性能优势替代传统8位MCU,同时保持低成本、小封装、宽电压的特点,是小家电、传感器节点、消费电子等场景的高性价比选择。普冉的开发支持体系进一步缩短了产品从原型到量产的周期,适合对成本敏感且需要32位处理能力的终端设计。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.