WMSIC Electronic Components

Prisemi PTVSHC1DF7VBH

ModelPTVSHC1DF7VBH
PackageSOD-123F
BrandPRISEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Prisemi PTVSHC1DF7VBH
Type
PRISEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PRISEMI
Electronic Component
PTVSHC1DF7VBH
Electronic Component
1
Package
SOD-123F
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.042g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
520pF
Electronic Component
BM0226527246
Voltage
22V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
200uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PTVSHC1DF7VBH 产品概述

一、产品简介

PTVSHC1DF7VBH 是 Prisemi(芯导)推出的一款单路、双向瞬态抑制二极管(TVS),采用 SOD-123F 小封装,专为瞬态浪涌与静电放电(ESD)保护设计。器件响应速度快、耐脉冲能力强,适用于对电源轨和信号线的过压过冲保护。

二、主要特性

  • 钳位电压:22 V(典型),在浪涌期间限制电压峰值,保护后端器件免受过压损伤。
  • 击穿电压(Vbr):7.8 V(典型),维持在安全工作区用于触发导通。
  • 反向工作电压(Vrwm):7 V,适合约 5–7V 级别电源保护场合。
  • 峰值脉冲功率:3.7 kW @ 8/20 μs,能承受一次性高能脉冲浪涌。
  • 峰值脉冲电流:185 A @ 8/20 μs。
  • 结电容 Cj:520 pF(典型),对高速差分信号可能有影响,宜在电容预算内使用。
  • 反向漏电流 Ir:200 μA(典型),低漏电适合多数低功耗应用。
  • 极性:双向,单芯通道,方便对交流或双向信号线并联保护。
  • 符合 IEC 61000-4-4(EFT)与 IEC 61000-4-2(ESD)抗扰度要求。

三、关键电气参数(要点)

  • 类型:TVS(瞬态抑制二极管)
  • 通道数:单路(Single Channel)
  • 封装:SOD-123F(紧凑型表面贴装)
  • 峰值脉冲功率:3.7 kW @ 8/20 μs
  • 峰值脉冲电流:185 A @ 8/20 μs
  • 钳位电压:22 V
  • 击穿电压:7.8 V
  • 反向工作电压 Vrwm:7 V
  • 结电容 Cj:520 pF
  • 反向漏电流 Ir:200 μA

四、典型应用场景

  • 车载子系统与车载通信总线的瞬态浪涌保护(需留意汽车温度与认证要求)。
  • 工业控制与仪表的电源轨、信号输入端口保护(抗 ESD、EFT)。
  • 通信设备、家电、消费电子的局部电源与线缆入口浪涌防护。
  • 对于需要双向保护的数据信号或交流小电压回路尤为适用。

五、封装与可靠性

SOD-123F 小型表面贴装封装利于 PCB 布局密集化。由于封装热阻和寄生参数限制,器件适合承受短时单次脉冲(8/20 μs)能量;在频繁或多次大能量冲击场合,应按系统级方案(加入熔断器、限流电阻或更高功率 TVS)进行等级提升。产品通过 IEC 61000-4-2/4-4 抗扰度验证,满足常见工业和消费级抗干扰需求。

六、注意事项与选型建议

  • Cj=520 pF,对高速差分接口(如 USB3.x/HDMI)可能引入信号损耗或带宽下降;若保护高速信号,优先选用低电容型 TVS。
  • SOD-123F 封装热量有限,PCB 上应考虑散热铜箔以及合理器件间距;避免长时间重复大电流脉冲。
  • 对于需要严格低漏电的电池供电系统,请评估 Ir(200 μA)对待机功耗的影响。
  • 推荐采用标准回流焊工艺,遵循厂家建议的温度曲线和焊接说明以保障焊点可靠性。
  • 订货信息:品牌 Prisemi(芯导),型号 PTVSHC1DF7VBH,封装 SOD-123F。

如需样品参数曲线(钳位曲线、漏电随温度变化等)、PCB 布局参考或替代型号比较,我可以继续提供更详细的资料与设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.