WMSIC Electronic Components

Prisemi PSBD3D40V1H

ModelPSBD3D40V1H
PackageSOD-323
BrandPRISEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Prisemi PSBD3D40V1H
Type
PRISEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PRISEMI
Electronic Component
PSBD3D40V1H
Electronic Component
1
Package
SOD-323
Electronic Component
Schottky Diode
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0227234105
Current
1A
Diode
1
Current(Ir)
100uA@40V
(Vf)
500mV@1A
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PSBD3D40V1H — Prisemi(芯导) 肖特基二极管产品概述

一 产品简介

PSBD3D40V1H 为 Prisemi(芯导)出品的低压肖特基整流二极管,单管可实现连续整流电流 1A,适用于中低功率、高效率电源设计与保护电路。器件采用 SOD-323 小型封装,适合空间受限且需要低正向压降的表面贴装应用。

二 主要电气参数

  • 正向压降 Vf:500mV @ 1A(低压降特性有助于减少整流损耗)
  • 直流反向耐压 Vr:40V,适合 12V、24V 系统的整流与保护
  • 反向电流 Ir:100μA @ 40V(高温下漏电需关注)
  • 非重复峰值浪涌电流 Ifsm:25A(一次性或短时冲击能力,需按波形与时间限制使用)
  • 连续整流电流:1A
  • 工作结温范围:-55℃ 至 +125℃

三 关键特性与优势

  • 肖特基结构带来低正向压降与极快开关速度,显著降低导通损耗与开关损耗。
  • SOD-323 小封装适配高密度贴装,焊接性良好,适合自动化贴装流程。
  • 宽工作结温范围满足工业级环境需求。

四 应用场景

  • 开关电源整流与二次侧整流
  • DC-DC 转换器输出整流与同步整流替代件
  • 反向极性/防反接保护、续流二极管(freewheeling)
  • 电池充电/管理、车载电子(需注意温度与漏电)
  • 通信、电源管理模块等小功率、高效率场合

五 设计与使用注意事项

  • 虽然 Ifsm 达 25A,但该为非重复峰值,应避免反复大幅冲击;设计时按实际冲击波形(如 8/20μs、10ms)核算并加保护。
  • 反向漏流 100μA 在高温或高 Vr 下会增加,应在热设计和待机能耗预算中考虑。
  • SOD-323 封装散热能力有限,连续 1A 工作时要做好 PCB 铜箔散热与热过渡设计,必要时并联或选用更大封装。
  • 推荐遵循厂商的回流焊工艺规范进行焊接,避免过热导致封装应力或性能退化。

六 选型建议与替代方案

  • 若系统电压或反向耐压要求高于 40V,应选用更高 Vr 的肖特基或标准整流二极管。
  • 对于低温漂、超低漏电场合,可考虑低漏电设计的型号;需在数据表中比对 Vf、Ir 与 Ifsm 及热阻参数。
  • 在需更高持续电流或更好散热时,优先选择功率封装(SOD-123、SOD-128 或 SMA)或使用多颗并联并合理匹配。

如需器件真实数据表(datasheet)、封装图或在特定电路中的仿真建议,我可为您提供下一步支持或比较替代器件清单。

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