WMSIC Electronic Components

Prisemi PNM723T703E0-2 PNM723T703E0

ModelPNM723T703E0-2
PackageSOT-723
BrandPRISEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Prisemi PNM723T703E0-2
Type
PRISEMI
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PRISEMI
Electronic Component
PNM723T703E0-2
Electronic Component
1
Package
SOT-723
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.061g
Electronic Component
1
Electronic Component
BM0226527248
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component
Electronic Component
10000
Voltage(Vdss)
40V
Capacitor(Ciss)
40pF
Output Capacitor(Coss)
20pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PNM723T703E0-2 产品概述

一、产品简介

PNM723T703E0-2 是 Prisemi(芯导)推出的一款小型 N 沟道绝缘栅场效应管(N‑MOSFET),设计用于低功耗、低电流的开关和信号切换场合。器件耐压 40V,采用 SOT‑723 超小封装(无铅),适合空间受限的便携式和消费类电子产品。

二、主要电气参数

  • 漏源电压 Vdss:40 V(最大耐压,适用于中低压电源系统)
  • 导通电阻 Rds(on):7.5 Ω @ Vgs = 10 V(在 10V 驱动时导通电阻较高,适合小电流负载)
  • 阈值电压 Vgs(th):约 1.5 V(在此电压附近开始导通)
  • 连续漏极电流 Id:180 mA(器件适用于小电流持续工作)
  • 功耗 Pd:150 mW(封装热阻及散热能力有限,应注意功耗限制)
  • 输入电容 Ciss:40 pF;输出电容 Coss:20 pF;反向传输电容 Crss:5 pF(小电容值利于快速开关与低驱动能耗)

三、封装与热特性

  • 封装:SOT‑723(超小型封装,PCB 占板面积小)
  • 无铅(RoHS 兼容)
  • 由于 SOT‑723 的体积与引脚面积很小,器件的散热能力受限,150 mW 的耗散功率在实际电路中需严格控制。长时间接近 Pd 极限会导致结温升高并影响可靠性。

四、典型应用场景

  • 低电流开关:小型负载的低侧开关、信号断开/连接
  • 电池供电设备:功耗敏感的便携设备中的电源管理与负载隔离(注意电流和导通损耗)
  • 电平转换与逻辑信号控制(适用于需要隔离或低电容负载的场合)
  • 小信号放大/开关电路(替代机械继电器或大封装 MOSFET 于微弱电流应用)

五、使用与布局建议

  • 驱动电压:器件给定 Rds(on) 为在 Vgs = 10 V 条件下测得,阈值约 1.5 V;若门极仅由 3.3 V 或更低逻辑电平驱动,导通电阻会显著增大,应评估是否满足电流与功耗要求。
  • 热管理:尽量降低在器件上的功耗(I²·Rds),在 PCB 设计中为器件提供合理的散热铜箔面积与短的连接引线,避免长期在 Pd 附近工作。
  • 开关速度:器件电容较小(Ciss 40 pF,Coss 20 pF,Crss 5 pF),适合快速切换,且对驱动要求低,可实现较小的驱动损耗。
  • ESD 与栅极保护:虽然阈值低但栅极耐压有上限(请参考完整数据手册),焊接与调试时注意静电防护与过压保护。
  • 测试与验证:在最终产品中应进行热仿真与实际温升测试,验证在最大工作电流和频率下结温是否满足长期可靠性需求。

六、性能优势与选型要点

  • 优势:超小封装、低电容、适合高速小信号开关;适用于体积受限且电流不大的便携式应用。
  • 选型要点:若工作电流接近或超过几十毫安且需低压差导通,应注意 7.5 Ω(@10 V)这一较高的导通电阻带来的功耗;对 3.3 V 或更低驱动电平下的表现需通过数据表或实际测量确认是否满足要求。对于需较大导通电流或更好散热的场合,应优先考虑更低 Rds(on) 或更大封装的 MOSFET。

欲获得完整的极限参数、热阻、典型特性曲线与封装图纸,请参考厂商原始数据手册或联系 Prisemi 技术支持。

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