WMSIC Electronic Components

Prisemi PESDMC2FD18VB

ModelPESDMC2FD18VB
PackageDFN1006
BrandPRISEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Prisemi PESDMC2FD18VB
Type
PRISEMI
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PRISEMI
Electronic Component
PESDMC2FD18VB
Electronic Component
1
Package
DFN1006
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.01g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
0.3pF
Electronic Component
BM0231132872
Operating Temperature
55℃~+150℃
Voltage
60V
Electronic Component
IEC 61000-4-2

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PESDMC2FD18VB 产品概述

一、产品简介

PESDMC2FD18VB 是 Prisemi(芯导)推出的一款高性能双向瞬态电压抑制器(TVS/ESD),封装为超小型 DFN1006。该器件专为对信号线、接口及小尺寸电子设备提供静电放电(ESD)和浪涌保护设计,具有低结电容、低漏电、高能量吸收能力等优点,适合移动终端、数据通信和工业控制等场景。

二、主要规格要点

  • 极性:双向(适合正负摆幅信号或差分接口)
  • 反向工作电压 Vrwm:18 V
  • 击穿电压 VBR:24 V
  • 钳位电压(典型):60 V(在 8/20 µs 波形下)
  • 峰值脉冲电流 Ipp:2.5 A @ 8/20 µs
  • 峰值脉冲功率 Ppp:120 W @ 8/20 µs
  • 反向电流 Ir:1 µA(典型,低泄漏)
  • 结电容 Cj:0.3 pF(非常适合高速信号线)
  • 通道数:单路
  • 工作温度:-55 ℃ ~ +150 ℃
  • 防护等级:符合 IEC 61000-4-2(ESD 保护)
  • 封装:DFN1006(超小型,约 1.0 × 0.6 mm)
  • 品牌/型号:Prisemi / PESDMC2FD18VB

三、性能亮点

  • 超低结电容(0.3 pF):对高速信号线(USB、HDMI、LVDS、MIPI、差分串行)几乎无影响,保持信号完整性。
  • 双向结构:支持正负方向的瞬态抑制,适用于差分或交流耦合信号保护,无需考虑极性方向。
  • 高能量吸收能力:在常见 8/20 µs 浪涌测试下可承受 2.5 A 的脉冲电流和 120 W 的瞬时功率,能有效钳制瞬态至 60 V 水平,保护下游器件。
  • 低漏电流(1 µA):适合对静态功耗敏感的电路,尤其是便携设备和电池供电系统。

四、典型应用场景

  • 手机、平板、可穿戴设备等移动终端的外部接口保护(耳机、充电口、数据口)。
  • USB、HDMI、MIPI、LVDS、CAN 等高速差分信号线的防护。
  • 工业现场总线、传感器接口及需要抗静电和浪涌的低电压控制线。
  • IoT 设备、无线模块和 PCB 小空间的保护元件,尤其适合空间受限的设计。

五、PCB 布局与实用建议

  • 器件应尽量靠近被保护的连接器或接口放置,缩短走线以降低回路电感,从而提高抑制效果。
  • 在 DFN1006 封装周围保持足够的接地平面,确保大电流脉冲有低阻抗回流路径。
  • 对于高频差分信号,注意避开过多平行走线及长串接,以免引入串扰。
  • 如需承受更强浪涌,考虑与串联电阻、抑制二极管阵列或熔断器配合使用,以分担热应力和能量。

六、选型与可靠性考虑

  • 若保护的是直流或单向电源线,优先考虑单向 TVS;若为交流或差分信号,双向 PESDMC2FD18VB 更合适。
  • Vrwm(18 V)应高于电路正常工作电压但留有安全裕度,避免在正常工作时频繁进入击穿区域。
  • 工作温度范围宽(-55 ~ +150 ℃),适用于工业级环境,但在高功率脉冲下需关注封装热耗散与 PCB 散热设计。
  • 器件已满足 IEC 61000-4-2 类标准的 ESD 抗扰度,能有效提升产品在实际使用中的可靠性与合格率。

总结:PESDMC2FD18VB 以其超低电容、双向保护和高脉冲能力,成为对高速信号线与小空间接口进行可靠 ESD/浪涌防护的优选器件。合理的 PCB 布局与配套保护措施能进一步提高系统的抗扰能力与寿命。

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