WMSIC Electronic Components

Prisemi PDTC123JE

ModelPDTC123JE
PackageSOT-523
BrandPRISEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Prisemi PDTC123JE
Type
PRISEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
PRISEMI
Electronic Component
PDTC123JE
Electronic Component
1
Package
SOT-523
Electronic Component
1 NPN
Electronic Component
Digital Transistor
Electronic Component
0.025g
Electronic Component
1
Electronic Component
BM0259740518
Resistor
26
Resistor
2.86kΩ
Transistor Type
NPN
Frequency(f T)
250MHz
Power Dissipation(Pd)
150mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PDTC123JE 产品概述

一、产品简介

PDTC123JE 是 Prisemi(芯导)推出的数字晶体管,采用 SOT-523 超小封装,集成了 NPN 晶体管与基极限流电阻,便于直接与逻辑电平或 MCU 输出接口驱动负载。其面向小电流开关应用,体积小、布局密集、免去外接电阻的设计工作量。

二、主要电气参数

  • 集电极电流 Ic:100 mA(最大)
  • 耗散功率 Pd:150 mW(器件级)
  • 晶体管类型:NPN
  • 直流电流增益 hFE:约 80(在 Ic=10 mA、VCC=5 V 条件下)
  • 输入开启电压 VI(on):典型约 1.1 V(在驱动 5 mA 条件),在弱驱动状态也可低至 ~0.3 V(视条件)
  • 输入关断电压 VI(off):约 500 mV(在小输入电流 ~100 μA、VCC=5 V 条件)
  • 输出导通电压 VO(on):约 300 mV(在 Ic≈5 mA 条件)
  • 内置输入电阻:约 2.86 kΩ,电阻比率约 26(用于限流与偏置)

三、典型应用场景

  • MCU 或逻辑门直接驱动小信号继电器、指示灯(LED)或小型有源负载
  • 电平转换与开漏替代电路,用于板级信号控制与负载开关
  • 空间受限的便携设备、可穿戴或 IoT 终端的输出级

四、设计与选型建议

  • 留意功耗与散热:Pd 仅 150 mW,应避免在高集电极电流下长时间工作或频繁开关导致热累积。
  • 若负载电流接近 100 mA 或存在较大安全裕量需求,建议选用更大功率器件或并联措施。
  • 内置电阻便于直接连接 MCU 引脚,但若需精确控制基流或更快开关速度,可在外部增加电阻或驱动级。
  • 输出侧需要考虑 VO(on)(约 300 mV)对负载影响,尤其在低电压系统中需评估压降带来的可用电压减少。

五、封装与可靠性

SOT-523 超小化封装适合高密度贴装与表面贴装自动化生产。器件适用于常见温度与电压工况,但在恶劣环境(高温、高功耗)下应严格遵守器件最大额定值以保证可靠性。

六、小结

PDTC123JE 提供了便捷的一体化数字晶体管解决方案,适用于占板面积受限、需直接由逻辑电平驱动的小功率开关场合。选型时关注最大集电极电流、耗散功率与输出导通压降,合理匹配负载与散热条件,能在多种嵌入式与消费电子应用中简化设计并提高系统集成度。

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