WMSIC Electronic Components

Power Integrations TOP271VG

ModelTOP271VG
PackageeDIP-12
BrandPOWER INTEGRATIONS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Power Integrations TOP271VG
Type
POWER INTEGRATIONS
Minimum package
48 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
POWER INTEGRATIONS
Electronic Component
TOP271VG
Electronic Component
1
Package
eDIP-12
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
1.069g
Electronic Component
1
Features
(OTP); (OVP);; (SCP); (UVP); (OCP)
Electronic Component
Electronic Component
Electronic Component
BM0263433374
Electronic Component
PWM
Operating Temperature
40℃~+150℃
Switching Frequency
66kHz;132kHz
Electronic Component
Electronic Component
Isolation
Non-isolated

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TOP271VG 产品概述

一、概述

TOP271VG 是 Power Integrations(帕沃英蒂格盛)面向离线开关电源应用的反激式开关转换器芯片,采用 eDIP-12 封装,集成高压功率晶体管与控制电路。器件针对直接接入市电的非隔离反激拓扑进行了优化,具有高压耐受、宽温度工作范围及多重保护功能,适合体积受限、成本敏感的离线电源设计。

二、主要特性

  • 拓扑结构:反激式(离线非隔离)
  • 开关频率:66 kHz / 132 kHz 可选,适配不同的滤波与变压器设计需求
  • 最大占空比:78%,有利于提高输出功率密度
  • 内置功率晶体管耐压:725 V,支持直接面向高压工况
  • 多重保护:过热保护(OTP)、短路保护(SCP)、过压保护(OVP)、过流保护(OCP)
  • 工作温度:-40 ℃ ~ +150 ℃(结温 Tj)
  • 封装:eDIP-12,便于散热与双列插装板设计

三、典型应用场景

  • 小功率壁式/桌面式适配器与充电器
  • LED 驱动器与照明电源(非隔离类)
  • 家用小电器与白色家电的辅助电源
  • 需要体积紧凑、成本优化的离线电源模块

四、设计要点与建议

  • 热设计:由于集成高压功率晶体管并支持高结温,需注意 PCB 散热路径与散热膜,eDIP-12 封装可借助底部焊盘和散热铜箔降低结温。
  • 滤波与 EMI:66 kHz 与 132 kHz 两档工作频率在滤波器与磁元件设计上有不同取舍,高频有利于减小磁性元件尺寸,但对 EMI 管理更为严格,建议配合差模/共模滤波器和合理布线。
  • 保护协调:器件内置 OTP/SCP/OVP/OCP,外部仍需合适的输入浪涌抑制与输出限流设计以防极端工况下的次级损坏。
  • 变压器与磁性元件:反激拓扑要求关注磁芯选型和气隙设计,结合 78% 最大占空比进行匝比与磁通裕量计算,避免磁芯饱和。
  • 安全与认证:尽管描述为“非隔离”方案,若后续产品需满足人员或系统安全隔离,应重新评估拓扑并采用隔离型设计与对应认证。

五、封装与可靠性

eDIP-12 提供便于手工或自动插装的引脚布局,利于快速样机验证与小批量生产。器件的高温额定(-40 ℃ 到 +150 ℃)适用于苛刻环境,但长期可靠性依赖于热管理、工作点与实际动态应力水平的综合控制。

六、总结

TOP271VG 汇集高压耐受、可选工作频率及完整的保护功能,是面向小型离线反激电源的实用解决方案。合理的磁性元件设计、良好的热和 EMI 控制,以及对保护策略的配合,能充分发挥其在体积、成本与可靠性之间的平衡优势。

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