WMSIC Electronic Components

ROHM 2SK3065T100

Model2SK3065T100
PackageTO-243AA
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM 2SK3065T100
Type
ROHM
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
2SK3065T100
Electronic Component
1
Package
TO-243AA
Electronic Component
1 N
Electronic Component
MOSFET
Electronic Component
0.129g
Electronic Component
1
Electronic Component
BM0000278960
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
520mW
Electronic Component
Electronic Component
Electronic Component
1000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

2SK3065T100 产品概述

一、产品背景

2SK3065T100是由ROHM(罗姆)公司生产的一种高性能N沟道金属氧化物半导体场效应管(MOSFET),专为表面贴装应用设计,封装类型采用MPT3(SOT-89),具有体积小巧、散热性能优越等特点。该MOSFET广泛应用于电源管理、电机驱动和开关电路等领域。

二、主要规格

  • 安装类型:表面贴装型
  • N沟道特性:该器件采用N沟道设计,能够在低电压下高效导通。
  • 导通电阻:在1A和4V的条件下,导通电阻Rds(on)最大可达320毫欧,确保了在导通时能够有效降低功率损耗。
  • 驱动电压:最小驱动电压为2.5V,确保该MOSFET能够在低电压下稳定工作。
  • 漏极电流:在25°C环境温度下,该MOSFET支持连续漏极电流(Cid)最大为2A,适用于一般的负载需求。
  • 漏源电压:额定漏源电压(Vdss)为60V,能够处理多种应用中的高电压情况。
  • 功率耗散:最大功率耗散为500mW,这使得该MOSFET在正常工作情况下几乎不易过热,从而提升系统的可靠性。
  • 输入电容:使用该MOSFET时,输入电容Ciss在10V下最大为160pF,表明在开关频率较高的应用中,器件的切换速度也相对较快。
  • 温度范围:最高工作温度可达150°C,适应更为苛刻的工作环境。

三、应用领域

2SK3065T100广泛应用于:

  1. 消费电子产品:由于其小型化封装,适用于手机、平板电脑和其他便携式设备的电源管理。
  2. 电源转换设备:如DC-DC转换器和AC-DC适配器中的开关元件,能够在高频条件下高效工作。
  3. 电机控制:可作为电机驱动电路中的开关器件,提供高效的电流开关能力。
  4. 照明系统:适用于LED照明驱动电路中,提高整体系统的效率与应变能力。
  5. 自动化设备:在自动化控制的应用中,能够提供可靠的信号开关,以满足对瞬态响应及稳定性要求较高的环境。

四、性能优势

  • 高效能:由于其优越的导通特性和较低的Rds(on),该MOSFET能够最大限度地减少功率损耗,从而提高系统效率。
  • 小型化:SOT-89封装的小型设计使其在空间有限的应用场合中尤为受欢迎。
  • 耐高温:支持高达150°C的操作温度,使得2SK3065T100可以在较为严苛的工作条件下运行,极大提高了系统的可靠性。
  • 广泛的电压和电流范围:适应多种应用场景,满足不同电压和电流的需求。

五、结论

总之,2SK3065T100是一款功能强大、表现稳定的N沟道MOSFET。凭借其在功耗、体积、耐温等方面的优化,该产品为电子设备的设计师提供了广泛的应用解决方案。ROHM作为领先的半导体材料供应商,持续致力于创新和产品改进,帮助客户满足高性能、高效率的需求。对于开发各类电源管理和开关电路的工程师而言,2SK3065T100无疑是一个值得信赖的选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.