WMSIC Electronic Components

ROHM KTR10EZPF1003

ModelKTR10EZPF1003
Package0805
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM KTR10EZPF1003
Type
ROHM
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
KTR10EZPF1003
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
100kΩ
Electronic Component
1
Electronic Component
BM0058411647
Operating Temperature
55℃~+155℃
Electronic Component
±100ppm/℃
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ROHM KTR10EZPF1003 产品概述

一、产品简介

KTR10EZPF1003 是 ROHM(罗姆)旗下的一款贴片厚膜电阻,阻值 100 kΩ,精度 ±1%,功率额定值为 125 mW,适用温度范围为 -55 ℃ 到 +155 ℃。该器件以稳定的工艺与性价比著称,适合一般电子设备中对精度和耐温性能有一定要求的场合。

二、主要参数(概要)

  • 阻值:100 kΩ
  • 精度:±1%
  • 温度系数(TCR):±100 ppm/℃
  • 功率额定:125 mW(室温)
  • 工作温度:-55 ℃ ~ +155 ℃
  • 电阻类型:厚膜电阻
  • 封装:0805(公制 2012,约 2.0 mm × 1.25 mm)
  • 品牌:ROHM(罗姆)

三、封装与机械特性

0805 封装(约 2.0 × 1.25 mm)是常用的中小尺寸 SMD 类型,便于高速贴片和回流焊装配。厚膜电阻结构使其具有良好的机械强度和焊接可靠性,兼容常规回流焊工艺,适合自动化贴装生产线。

四、电气性能与计算示例

  • 最大允许电压(理论值):Vmax = sqrt(P·R) = sqrt(0.125 W × 100000 Ω) ≈ 112 V
  • 最大允许电流(理论值):Imax = sqrt(P / R) ≈ 1.12 mA

温漂方面,TCR = ±100 ppm/℃ 相当于阻值随温度变化约 0.01%/℃(100 kΩ 时约 10 Ω/℃)。在完整温度区间(-55 ℃ 到 +155 ℃,跨度 210 ℃)理论温漂约为 210 × 100 ppm = 21000 ppm,即约 ±2.1%,与初始 ±1% 精度叠加后需在设计中一并考虑总体误差。

五、性能与可靠性特点

  • 厚膜工艺:成本效益高、适用面广,温漂与噪声性能在可控范围内,适合多数模拟与数字电路应用。
  • 宽温适应:-55 ℃ ~ +155 ℃ 的工作温度使其适合高温或工业环境。
  • 稳定性:在合理的功率和温度环境下具有长期稳定性;但在高温高功率工况下应参考厂商降额曲线并适当预留裕度。

六、典型应用场景

  • 阻容滤波与分压电路(电压分压、参考、偏置)
  • 信号处理与放大器电路中的反馈与偏置元件
  • 工业控制与高温工作环境下的一般用途阻值元件
  • 便携式或消费电子中对体积与精度有折中需求的场合

七、选型与注意事项

  • 功率降额:在高环境温度下,额定功率需按厂商提供的降额曲线进行降额设计,避免长期过载。
  • 温漂与精度叠加:TCR 与初始公差会共同影响工作条件下的实际阻值,应根据系统总误差预算选择合适等级。
  • 噪声与长期漂移:厚膜电阻相比薄膜在长期漂移与噪声上可能略逊一筹,若为高精度低噪声应用建议评估替代薄膜或金属膜方案。
  • 焊接工艺:兼容常规回流焊,但应避免反复重熔及超温,以免影响长期可靠性。

八、存储与使用建议

  • 贮存环境应干燥、无腐蚀性气体,避免潮湿和高温直射。
  • 贴装前尽量保持封装完整,避免手工触摸焊盘造成污染。
  • 在关键或极端工况(如高温、振动、冲击)使用前,建议参考 ROHM 官方datasheet 进行环境与寿命评估。

总结:KTR10EZPF1003 以其 100 kΩ 的通用阻值、±1% 的精度和宽温特性,适合多种工业与消费电子应用。在设计中应综合考虑功率降额、温漂及长期稳定性,以确保电路性能与可靠性。若需用于关键或特殊应用,建议查阅 ROHM 官方资料或联系技术支持获取更详细的可靠性与降额信息。

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