WMSIC Electronic Components

ROHM KDZVTFTR5.6B

ModelKDZVTFTR5.6B
PackageSOD-123FL
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM KDZVTFTR5.6B
Type
ROHM
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
KDZVTFTR5.6B
Electronic Component
1
Package
SOD-123FL
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0229305256
Diode
1
Power Dissipation(Pd)
1W
Electronic Component
5.6V~6.3V
Electronic Component
Electronic Component
Electronic Component
3000
Electronic Component
5.6V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KDZVTFTR5.6B 产品概述

一、概述

KDZVTFTR5.6B 是 ROHM(罗姆)推出的一款小功率稳压二极管,封装为 SOD-123FL,属于独立式(离散)稳压二极管。标称稳压值为 5.6V,稳压范围规格给出 5.6V~6.3V,最大耗散功率 Pd 为 1W,反向漏电流 Ir 标称为 20μA(在 1.5V 处测量)。适用于需要小体积、面装封装的低功耗基准或钳位应用。

二、主要特性

  • 标称稳压:5.6V(规格范围 5.6V~6.3V)
  • 最大耗散功率:1W(器件级,需关注散热与热量分配)
  • 反向漏电流:20μA @ 1.5V
  • 封装:SOD-123FL,适合表面贴装、自动化焊接
  • 制造商/品牌:ROHM(罗姆)

三、电气参数说明与设计提示

稳压值通常在规定的测试电流下测得,数据表会给出测量电流、动态电阻和温度系数。本处提供的 Ir 为在 1.5V 条件下的反向漏电流,实际在高电压或高温时会增加。理论上的最大稳流可由 Pd/Vz 估算:Iz_max ≈ 1W / 5.6V ≈ 178mA,但实际应用必须考虑器件热阻与封装散热,建议工作电流远低于此值以保证长期可靠性与稳定的稳压性能。

四、典型应用

  • 低功率电压基准与偏置源
  • 输入/信号线的小幅度过压钳位与浪涌吸收
  • 微控制器供电保护、ADC 参考源的简单方案
  • 消费类与工业电子中对体积与成本敏感的稳压需求

五、选型与使用建议

  • 功率与散热:在板级设计中应按热平衡设计,避免在高环境温度或无良好散热情况下接近 1W 极限。推荐按安全裕度(如 50%~70%)进行耗散设计。
  • 系列电阻计算:若从 Vin 到稳压点用其作分压/稳压器,Rs = (Vin − Vz)/(Iz + IL)。举例:Vin=12V,Vz=5.6V,取 Iz=5mA,负载 IL=1mA,则 Rs≈1.07kΩ,Pz≈5.6V×5mA≈0.028W,远低于 Pd。
  • 噪声与动态特性:齐纳/稳压二极管在低电流段有较高噪声和非线性,作为高精度参考时需谨慎并加入滤波或缓冲放大。
  • 查阅数据表:在最终设计前务必参考 ROHM 官方数据表,确认测试电流、温度系数、击穿曲线与封装热阻等详细参数。

六、封装与焊接注意

SOD-123FL 为低高度小型 SMD 封装,适合回流焊。焊盘设计应兼顾机械强度与热扩散,避免过度应力和长期高温工作导致性能退化。存储与焊接前注意防潮包装规定。

七、采购与质量

该型号由 ROHM 供应,适用批量自动化贴装。购买时注意批次、包装(卷盘)与产地信息,必要时向供应商索取交货数据单与可靠性报告。

小结:KDZVTFTR5.6B 提供紧凑的 5.6V 稳压方案,适用于对体积和成本敏感的低功耗应用。合理配置限流/散热并参照原厂数据表,可在多种电路中稳定工作。

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