WMSIC Electronic Components

ROHM CDZVT2R16B

ModelCDZVT2R16B
PackageSOD-923
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM CDZVT2R16B
Type
ROHM
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
CDZVT2R16B
Electronic Component
1
Package
SOD-923
Electronic Component
Zener Diode
Electronic Component
0.004g
Electronic Component
1
(Zzk)
80Ω
(Zzt)
50Ω
Electronic Component
BM0258716557
Diode
1
Current(Ir)
100nA@12V
Power Dissipation(Pd)
100mW
Electronic Component
15.85V~16.51V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CDZVT2R16B 产品概述

一、简介

CDZVT2R16B 是 ROHM(罗姆)推出的一款小型表面贴装稳压二极管,标称稳压值为 16V,采用 SOD-923 封装,主要用于电压基准、浪涌保护和低功耗电源稳压场合。器件体积小、漏电流低,适合空间受限且对静态电流要求严格的便携式与消费类电子产品。

二、关键参数

  • 稳压值(标称):16V
  • 稳压值范围:15.85V ~ 16.51V
  • 反向电流 Ir:100nA @ 12V(典型低漏电)
  • 耗散功率 Pd:100mW(最大)
  • 动态阻抗 Zzt:50Ω(测试条件下)
  • 阻抗 Zzk:80Ω(测试条件下)
  • 封装:SOD-923(小型贴片)
  • 器件构型:单颗独立式稳压二极管

三、电气特性解析

  • 稳压精度:15.85–16.51V 的范围表明在规定测试条件下二极管的稳压波动较小,适用于对参考电压有一定稳定性要求的场合。
  • 漏电流:100nA(在 12V 时)说明器件在反向工作时的静态电流非常低,有利于电池供电或待机功耗受限的系统。
  • 动态阻抗(Zzt、Zzk):50Ω 与 80Ω 分别反映了在不同测试点或频率下的瞬时阻抗,阻抗越低,稳压时电压随电流变化的抑制能力越强。对设计者来说,这意味着在小电流范围内能保持较好的电压稳定性。
  • 功率限制:Pd=100mW 为器件允许的最大耗散,必须结合稳压电压和流过的电流计算实际功耗(P = Vz × Iz)。理论上最大直流电流约为 100mW / 16V ≈ 6.25mA,实际设计应留有裕量并进行热管理。

四、典型应用场景

  • 低功耗电源的局部稳压或参考电压来源
  • 电压检测与欠压/过压保护电路
  • 小信号浪涌抑制与电压整形
  • 便携设备、仪表及传感器子系统中的保护/参考电路

五、设计与使用建议

  • 工作电流选择:考虑到 Pd 限制与稳压质量,通常选择低于最大值的工作电流(例如 1–3mA)以兼顾稳定性与可靠性。示例:若输入 24V,需要得到 16V,期望 Iz=2mA,则限流电阻 R = (24V−16V) / 2mA = 4kΩ,并计算电阻上的功耗。
  • 热管理与余量:尽量不要长期工作在 Pd 上限,建议留 20%–40% 的余量(即实际耗散控制在 60–80mW 范围内)以提升长期可靠性。
  • PCB 布局:SOD-923 为小封装,焊盘设计要遵循厂方推荐尺寸,避免在元件下方形成热阻集聚;必要时加大地铜或散热垫来改善热散。
  • 抗浪涌能力:该器件适合小功率保护,不宜作为高能量冲击的主要抑制元件;如需处理更大浪涌,应配合限流元件或更大功率的保护器件使用。

六、封装与可靠性

SOD-923 为超小型贴片封装,便于高密度组装与自动化贴装,适用于对体积和重量敏感的终端产品。ROHM 品牌在封装一致性与品质控制上具有保障,量产时建议参考厂方的封装尺寸与回流焊曲线以保证焊接良率与长期可靠性。

七、结语

CDZVT2R16B 以其 16V 的稳压值、极低的反向漏电和小型化封装,适合用于低功耗与空间受限的稳压和保护应用。在系统设计中应重点考虑功耗与热量管理,合理选择工作电流与限流元件,以发挥器件在低漏电与稳定性方面的优势。若需更详细的参数与封装资料,建议查阅 ROHM 的正式数据手册以获得完整测试条件与典型曲线。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.