WMSIC Electronic Components

ROHM EDZVT2R2.2B

ModelEDZVT2R2.2B
PackageSC-79(SOD-523)
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM EDZVT2R2.2B
Type
ROHM
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
EDZVT2R2.2B
Electronic Component
1
Package
SC-79(SOD-523)
Electronic Component
Zener Diode
Electronic Component
0.011g
Electronic Component
1
(Zzt)
100Ω
Electronic Component
BM0257826619
Diode
1
Power Dissipation(Pd)
150mW
Electronic Component
2.22V~2.41V
Electronic Component
Electronic Component
Electronic Component
8000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ROHM EDZVT2R2.2B 产品概述

一、产品简介

EDZVT2R2.2B 是 ROHM(罗姆)推出的一款独立型低压稳压二极管,标称稳压值约 2.2V,实际出厂范围为 2.22V ~ 2.41V,采用小型 SOD-523(SC-79)封装。该器件针对空间受限、功耗受控的便携与低功耗电路提供简单可靠的基准/稳压解决方案,常用于基准电压、信号钳位与低压保护等场合。

二、主要参数(摘要)

  • 类型:独立式稳压二极管(Zener)
  • 标称稳压:2.2V(出厂范围 2.22V ~ 2.41V)
  • 反向漏电流 Ir:120 μA @ 0.7 V(规格给定)
  • 动态阻抗 Zzt:100 Ω(影响电压随电流变化的稳定性)
  • 最大耗散功率 Pd:150 mW(器件热限)
  • 封装:SOD-523(SC-79),适合高密度贴片组装
  • 品牌:ROHM(罗姆)

三、特性要点与电气意义

  • 低稳压点:约 2.2V 的稳压点适合需要低电压参考的小信号电路,如低压传感器偏置、小电流参考源等。
  • 动态阻抗偏大:Zzt=100 Ω 表明在工作点附近电压对电流变化敏感,若需要更稳定的电压源,应在合适的偏流下工作或采用更低动态阻抗的方案。
  • 漏电流影响低电流精度:在反向偏压较低或偏流极小时,Ir(120 μ[email protected])会引入明显误差,需在设计时考虑漏电流对电压精度与偏置电流的影响。
  • 功率与热限制:Pd=150 mW 表明器件耐受的耗散有限。理论上最大连续电流约为 Pd / Vz ≈ 68 mA,但实际受封装散热和环境温度限制,要更保守地设定工作电流以避免热失控。

四、典型应用场景

  • 低压电压基准与偏置电源:为放大器输入或传感器提供简单参考电压。
  • 信号钳位与保护:在数字或模拟输入端做过压钳位,保护后级电路。
  • 便携式与电池供电设备:占用空间小、适合对功耗敏感的应用(需注意热耗限制)。
  • 低速模拟电路:用于需要简单稳压而非高精度基准的场合。

五、设计注意事项与建议

  • 工作电流选择:建议将稳态耗散控制在 Pd 的 30%~50% 以下,尤其在 SOD-523 这样的微小封装中更应保守,避免长期在接近 Pd 的条件下工作。通常可将偏流设计为微安至数毫安量级,具体由所需稳压精度与温漂决定。
  • 串联限流电阻:使用合适的串联电阻限制电流,既可保护二极管又能稳定工作点。电阻值按 (Vin - Vz) / Iz 计算,并考虑漏电流与容许功耗。
  • 温度与热管理:小封装散热能力有限,环境温度上升会降低允许电流,必要时在 PCB 上增加铜箔散热或采用更大封装器件。
  • 精度与噪声:该型号的稳压范围与动态阻抗表明其更适合作为粗稳压或钳位器件,不适合要求低噪声、高稳定性的精密参考用途。
  • 低电流精度修正:在微安级工作时,反向漏电流对稳定值影响显著,可通过提高偏流或选用低漏型器件来改善。

六、选型与替代建议

若目标为高度稳定、低噪声或较大功率应用,可考虑更低 Zzt、更窄容差或更大 Pd 的型号;若空间与成本为主、且稳压精度可接受,则 EDZVT2R2.2B 在小型便携应用中具有优势。选型时建议参考厂商完整数据手册,关注测试条件(测试电流、温度)与实际应用的偏流、散热条件匹配。

总结:EDZVT2R2.2B 以小封装和低稳压点为特点,适合对体积和功耗有严格限制的低压稳压与保护场合,设计时应重点关注工作电流、热耗与漏电流对稳压精度的影响。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.