WMSIC Electronic Components

ROHM RR1VWM6STFTR

ModelRR1VWM6STFTR
PackageSMD
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
ROHM RR1VWM6STFTR
Type
ROHM
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
RR1VWM6STFTR
Electronic Component
1
Package
SMD
Electronic Component
General Purpose Diode
Electronic Component
0.03g
Electronic Component
1
Electronic Component
BM0252997490
Current
1A
Diode
Electronic Component
Current(Ir)
10uA@600V
(Vf)
1.08V@1A
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RR1VWM6STFTR 产品概述

一、产品简介

RR1VWM6STFTR 是 ROHM(罗姆)推出的一款标准整流二极管,属于表面贴装型(SMD,PMDE 封装)。该器件面向一般整流与开关电源应用,提供高耐压与低正向压降的平衡设计,适合功率密度要求较高的消费与工业电子设备。

二、主要性能参数

  • 型号:RR1VWM6STFTR(ROHM)
  • 正向压降 Vf:1.08 V @ 1 A
  • 直流反向耐压 Vr(最大):600 V
  • 额定整流电流:1 A(直流)
  • 反向电流 Ir:10 μA @ 600 V
  • 非重复峰值浪涌电流 Ifsm:15 A
  • 封装:SMD(PMDE)

三、产品特点与优势

  • 低正向压降(1.08 V @1 A),在中等电流下能降低功耗与发热,提高整机效率。
  • 高耐压 600 V,适用于高压桥式整流与开关电源次级或初级整流场景。
  • 低反向漏电(10 μA @600 V),可减少待机功耗并提高系统可靠性。
  • 良好的冲击浪涌能力(Ifsm 15 A),能承受短时启动或异常浪涌电流。
  • SMD 封装有利于自动贴片生产与可靠焊接,提高生产效率与一致性。

四、典型应用

  • 开关电源整流与续流回路
  • 适配器与充电器整流桥
  • 工业电源与照明驱动电路
  • 消费电子设备的电源管理与保护电路

五、封装与热管理建议

  • 封装为表面贴装(PMDE),适合回流焊工艺。建议根据 ROHM 数据手册的推荐焊盘尺寸布局,以保证焊点可靠性。
  • 1 A 连续电流下仍需注意 PCB 散热:在焊盘下和周边加大铜箔面积并根据需要增加过孔散热,可降低结温并延长寿命。
  • 在高温或高压环境中应进行必要的电流与温度降额设计。

六、选型与注意事项

  • 若电路存在长期高浪涌或更高反向电压需求,请参考更大浪涌能力或更高耐压的型号。
  • 使用前请查阅 ROHM 官方数据手册获取完整的电气特性曲线、温度特性与封装尺寸,以便进行精确的热与电气设计。
  • 订货时确认完整型号(RR1VWM6STFTR)与生产批次以确保性能一致性。

如需更详细的封装尺寸、典型波形或等效电路图,可提供数据手册或进一步协助选型与电路设计建议。

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