WMSIC Electronic Components

ROHM EDZTE618.2B

ModelEDZTE618.2B
PackageSOD-523
BrandROHM
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
ROHM EDZTE618.2B
Type
ROHM
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
ROHM
Electronic Component
EDZTE618.2B
Electronic Component
1
Package
SOD-523
Electronic Component
Zener Diode
Electronic Component
0.02g
Electronic Component
1
(Zzk)
60Ω
(Zzt)
30Ω
Electronic Component
BM0228685890
Diode
1
Current(Ir)
500nA@5V
Power Dissipation(Pd)
150mW
Electronic Component
8.02V~8.36V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

EDZTE618.2B 产品概述

一、产品简介

EDZTE618.2B 是 ROHM(罗姆)出品的一款小型、高可靠性的单只稳压二极管,标称稳压值 8.2V,公差 2%,封装为超小型 SOD-523(2 引脚)。该器件针对空间受限、低功耗应用设计,适合作为基准电压源、过压保护和电平钳位使用。

二、主要电气参数

  • 稳压值(范围):8.02V ~ 8.36V(对应 8.2V ±2%)
  • 反向漏电流 Ir:500 nA @ 5.0 V
  • 最大耗散功率 Pd:150 mW
  • 动态阻抗 Zzt:30 Ω(测定点)
  • 曲线膝点阻抗 Zzk:60 Ω
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-523,2-pin(EMD)

三、关键特性与优势

  • 小型封装:SOD-523 占板面积小,适合移动设备和高密度 PCB 布局。
  • 低漏电流:500 nA 的反向漏电特性适合低功耗电路与精密偏置回路。
  • 良好稳压性能:8.2V±2% 的公差加上较低的动态阻抗(Zzt=30Ω),在小电流范围内具有较好的电压稳定性。
  • 宽温度范围:-55℃~+150℃ 的结温保证在恶劣环境下的可靠性。

四、典型应用场景

  • 作为中低电流的参考电压源(例如 MCU 外部参考、电源监测)。
  • 过压钳位与瞬态抑制(低能量浪涌或信号线保护)。
  • 偏置与电平移位电路。
  • 便携式、物联网和消费类电子的空间受限电源设计。

五、使用与设计建议

  • 功率与散热:器件额定耗散功率为 150 mW,但 SOD-523 的散热主要通过 PCB 进行,实际使用时应按降额原则设计。推荐在 PCB 条件下将稳压二极管承受的稳态功率控制在额定值的 40%~70% 范围内以提高可靠性。
  • 限流计算示例:若以 12V 输入建立 8.2V 基准并期望通过稳压二极管的工作电流约 1 mA,则限流电阻 R = (12V − 8.2V) / 1 mA ≈ 3.8 kΩ。
  • 瞬态与浪涌:用于浪涌钳位时应配合串联限流元件或旁路电路,避免长时间承受大电流导致过热失效。
  • 温度影响:漏电流和稳压值会随温度变化,需在系统级考虑温度漂移对基准精度的影响。
  • 旁路电容:在需要改善瞬态响应或降低噪声的场合,可在稳压二极管并联小容量陶瓷电容(如 0.01–0.1 µF)。

六、封装与可靠性注意事项

  • 焊接与装配:SOD-523 为贴片封装,推荐使用符合 IPC/JEDEC 的回流焊工艺。回流温度曲线请参照 ROHM 官方资料或通用回流规范;避免超出推荐峰值温度与时间。
  • PCB 布局:为改善散热与热一致性,建议增大焊盘铜箔面积并保证热回流路径,走线尽量短且粗;若放在热敏器件附近需评估热耦合影响。
  • 储存与处理:避免长时间潮湿环境存储,贴装前按制造商建议进行回流前干燥处理以防焊接缺陷。
  • ESD 防护:在生产与测试环节注意静电防护,敏感器件需在静电保护区操作。

总结:EDZTE618.2B 以其小型封装、低漏电与良好稳压特性,适合对体积和功耗敏感的中低电流基准与保护场合。设计时需重视散热与电流限流策略,以保证长期稳定性与可靠性。若需更详细的测试条件(如 Iz 测试电流、温漂曲线、典型特性曲线)建议参考 ROHM 官方数据手册。

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