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ROHM ESR18EZPF9100
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- ROHM ESR18EZPF9100
- Type
- ROHM
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- ROHM
- Electronic Component
- ESR18EZPF9100
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.028g
- Electronic Component
- 910Ω
- Electronic Component
- 1
- Electronic Component
- BM0058429661
- Operating Temperature
- 55℃~+155℃
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
ESR18EZPF9100 产品概述
一、概述
ESR18EZPF9100 为 ROHM（罗姆）出品的贴片厚膜电阻，封装为 1206（英制 3216）。标称阻值 910 Ω，阻值公差 ±1%，功率额定值 500 mW，温度系数（TCR）±100 ppm/℃，工作温度范围 -55℃ 至 +155℃。该系列适用于对抗噪声、分流、偏置及一般阻抗设定等通用电子电路设计需求。
二、主要规格
- 阻值：910 Ω
- 精度：±1%
- 功率：500 mW（额定功耗）
- 温度系数：±100 ppm/℃（典型）
- 工作温度：-55℃ 至 +155℃
- 封装：1206（厚膜贴片）
三、关键特性与优势
- 精度高：±1% 精度满足多数精密模拟与数字电路的阻值配比需求。
- 温漂控制：±100 ppm/℃ 的 TCR 在温度变化时提供相对稳定的阻值表现，适合对温度敏感度中等的应用。
- 可靠耐用：宽温度范围和厚膜工艺使其在工业、汽车电子及消费类设备中具有良好的环境适应性。
- 标准封装：1206 封装便于自动贴装与回流焊接，适配主流 SMT 生产流程。
四、典型应用
- 模拟放大器、滤波器网络的偏置与阻值设定
- 电源管理电路中的分压与限流
- 信号调理与阻抗匹配
- 工业控制、通信设备与消费电子中的通用终端元件
五、封装与装配注意
1206 尺寸便于贴片机取放与回流焊接，但在装配与回流工艺中仍建议参考 ROHM 官方数据手册获取具体焊接温度曲线与预热/回流规范，以避免热应力或焊接缺陷。
六、可靠性与使用建议
- 当环境温度接近上限时，应考虑降容使用或增加散热措施以保证长期可靠性。
- 在高精度场合，如需更低 TCR 或更高稳定性，可选择金属膜或薄膜电阻替代。
- 设计电路时留有适当的功率裕度（一般建议不在额定功率连续满载工作）以延长寿命。
七、储存与选型提示
- 储存时避免潮湿、高温与强腐蚀性气体环境，遵循常规电子元件保存规则。
- 选型时除阻值与功率外，注意封装尺寸、热阻、寿命试验与环境认证（如需用于汽车或特种工业，请核对相应认证与额外规格）。
欲获取详细机械尺寸、环境试验数据及完整电气特性表，请参阅 ROHM 官方数据手册或联系代理商索取样品与技术支持。
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