WMSIC Electronic Components

RUILON RLSD92A031V

ModelRLSD92A031V
PackageSOD-923
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON RLSD92A031V
Type
RUILON
Minimum package
8000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
RLSD92A031V
Electronic Component
1
Package
SOD-923
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.011g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
80pF
Electronic Component
BM0264391801
Operating Temperature
55℃~+150℃
Voltage
10.4V
Current(Ir)
2.5uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLSD92A031V 产品概述

一、产品简介

RLSD92A031V 是 RUILON(瑞隆源) 推出的一款单路单向 TVS 晶体二极管,针对 3.3V 工作电压系统的瞬态过压保护而设计。采用固态硅雪崩技术,封装为 SOD-923,体积小、适合集成到手机、配件及基于微处理器的便携式设备中,用于保护敏感 I/O 端口和接口免受浪涌与静电冲击损害。

二、主要电气参数

  • 极性:单向
  • 反向截止电压(Vrwm):3.3V
  • 击穿电压(VBR):5V
  • 钳位电压(Vclamp):10.4V(典型值,Ipp 条件下)
  • 峰值脉冲电流(Ipp):9.8A @ 8/20µs
  • 峰值脉冲功率(Ppp):150W @ 8/20µs
  • 反向漏电流(Ir):2.5µA
  • 结电容(Cj):80pF
  • 通道数:单路
  • 工作温度:-55℃ ~ +150℃
  • 类型:ESD/浪涌保护器件
  • 无铅 / RoHS 合规

三、主要特性

  • 高峰值吸收能力:在标准 8/20µs 浪涌波形下可承受 150W 峰值功率,峰值电流达 9.8A。
  • 低钳位电压:在浪涌事件中保持相对较低的钳位电压(典型 10.4V),降低被保护器件应力。
  • 低漏电流:静态漏电小(2.5µA),适合低功耗系统。
  • 小型封装:SOD-923 适合空间受限的移动终端与模块化设计。
  • 工艺可靠:硅雪崩工艺,温度范围广,可靠性高。

四、典型应用

  • 手机与移动配件(充电口、数据接口保护)
  • USB/串口/摄像头模块等外部接口防护
  • 基于微处理器的控制板、IoT 终端的 I/O 端口保护
  • 天线、射频前端的静电防护(需评估电容对信号的影响)

五、设计与布局建议

  • 尽量将 RLSD92A031V 靠近被保护的连接器或信号入口放置,缩短信号到器件的走线以降低寄生感抗。
  • 将器件的地引脚直接连接到低阻抗地平面,使用宽短走线以便快速分流浪涌能量。
  • 注意结电容 80pF 对高速/差分信号的影响,若用于高速数据线需评估信号完整性或选用低 Cj 版本。
  • 若系统可能遭受高能量脉冲,可考虑并联多个器件或在系统级增加串联限流元件(熔丝、阻抗)以分摊能量。
  • 校核被保护器件的最大耐压和钳位电压匹配,确保 Vclamp 在元器件承受范围内。

六、封装与可靠性

SOD-923 小封装利于节省 PCB 面积并满足自动贴装、回流焊接生产流程。器件工作温度范围宽(-55℃ ~ +150℃),且符合无铅/RoHS 要求,适合消费类与工业类产品的可靠性需求。为获得最佳可靠性,请遵循制造商的回流焊规范和储存防潮要求。

七、选型注意事项

  • 若对信号完整性敏感(高速接口、射频),优先评估 80pF 电容对带宽的影响。
  • 校对系统允许的最大钳位电压与器件的 Vclamp(10.4V)是否兼容。
  • 若系统常见更高能量浪涌,应选型更高 Ppp 或采用并联/系统级保护策略。
  • 验证漏电流在待机功耗预算内是否可接受(Ir = 2.5µA)。

结论:RLSD92A031V 以其 3.3V 工况优化、150W 峰值吸收能力及小型 SOD-923 封装,适合用于手机、配件及各类基于微处理器的便携设备的接口和 I/O 防护,是一种在空间受限场合兼顾保护性能与成本的实用选择。若需落地设计支持,可提供典型接线建议与 PCB 布局注意事项。

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