WMSIC Electronic Components

RUILON SMD1206P050TF

ModelSMD1206P050TF
Package1206
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD1206P050TF
Type
RUILON
Minimum package
4500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD1206P050TF
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.033g
Electronic Component
3.6mm
Electronic Component
0.8mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0246629404
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206P050TF — RUILON 6V 自恢复保险丝 产品概述

SMD1206P050TF 是瑞隆(RUILON)推出的一款 1206 封装自恢复聚合物过流保护器(PTC),专为低电压、需要自动复位保护的消费电子和工业设备设计。该器件在发生过流时能够迅速限制电流并在故障解除后自动恢复导通,适用于 USB、便携式设备、电源管理与信号线保护等场景。

一、主要参数与性能要点

  • 额定耐压(Vmax):6 V(适用于 5 V 类电源及更低电压系统)
  • 最大允许电脉冲电流(Imax):35 A(短时浪涌能力,具体浪涌能量视脉冲宽度与次数而定)
  • 保持电流(Ihold):400 mA(在规定环境温度下持续通过、不引起跳闸的最大电流)
  • 跳闸电流(Itrip):1 A(在规定条件下器件进入高阻态以限制电流的典型触发点)
  • 功耗(Pd):600 mW(在稳态工作时器件能承受的最大能量耗散能力)
  • 初始态电阻(Rmin):150 mΩ(正常工作时的低阻抗特性)
  • 跳断后电阻(R1max):700 mΩ(进入保护态后对电流的限制能力)
  • 动作时间:约 100 ms(从过流发生到保护动作的典型响应时间)
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 尺寸:3.6 mm × 1.9 mm × 0.8 mm(符合 1206 SMD 标准封装)

二、功能与应用场景

SMD1206P050TF 的自恢复特性使其非常适合用于需要反复过流保护且不宜频繁更换保护元件的场合。典型应用包括:

  • USB 供电保护(5 V 接口短路/过流防护)
  • 便携式电源与移动设备(充电口、模块电源输入)
  • 小型电机驱动与背光电源的瞬态浪涌抑制
  • 家用与工业控制板块的局部电源保护
  • LED 驱动与显示模块的过流限制

三、器件优势与设计考虑

  • 自恢复能力:在短路或超载事件解除后无需更换即可自动恢复工作,降低维修成本与停机时间。
  • 小尺寸封装:1206 封装适合高密度 PCB 布局,支持自动贴装与回流焊工艺。
  • 快速响应:约 100 ms 的动作时间可有效限制持续过流带来的热损害。
  • 高浪涌承受能力:标称 35 A 的瞬时能力允许器件应对常见的电源接入、热插拔等瞬态事件(需根据实际脉冲形式评估)。

设计时需注意:保持电流(Ihold)与实际工作电流匹配,连续工作电流应低于 Ihold,以避免器件在正常负载下进入高阻态。同时考虑环境温度对保持/跳闸性能的影响——在高温环境下器件更易触发保护,需要适当留有裕量。

四、封装与焊接建议

  • 尺寸信息(3.6 × 1.9 × 0.8 mm)符合 1206 标准,便于与常规贴片流片兼容。
  • 推荐将保护器件置于电源入口靠近电源源头的位置,以最小化保护范围内的导线阻抗与温升。
  • 使用标准焊膏与回流工艺进行贴装;焊接温度曲线应参照 PCB 上其他元件的热敏性进行协调,避免长时间高温暴露。
  • 为保证长期可靠性,布线时避免器件长时间贴近高功耗发热元件,并在可能的情况下提供一定的散热路径。

五、测试与可靠性

建议在产品开发阶段进行以下验证:

  • 实际工作电流与环境温度下的长期稳态测试,确认不会误触发保护。
  • 针对典型浪涌(不同脉冲宽度与幅值)进行脉冲承受能力验证,评估是否满足系统可能遇到的瞬态情形。
  • 多次过流-恢复循环试验,确认器件在重复动作后的电阻与性能稳定性(参考初始态 Rmin 与跳断后 R1max 指标)。

六、选型与替代建议

SMD1206P050TF 适合标称 500 mA 级别的过流保护场景(资料描述 6V 500mA),若系统正常工作电流接近或超过 Ihold(400 mA),应考虑:

  • 提高器件额定保持电流或选择更大封装/更高 Ihold 的型号;
  • 在高温或高负载条件下进行额外的裕量设计,以避免误动作;
  • 对于需要更高稳态电流保护的应用,选择额定电流更高或具有更大功耗能力的自恢复保险丝。

结语:SMD1206P050TF 为小型5~6V 电源线路提供经济且维护成本低的自恢复过流保护方案。合理匹配工作电流与布板散热设计,将能发挥其快速响应与自动复位的优点,提高系统可靠性与使用寿命。若需样品、电气特性曲线或更多应用资料,可联系瑞隆或其授权分销渠道获取详尽数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.