WMSIC Electronic Components

RUILON SMD1206P100TF

ModelSMD1206P100TF
Package1206
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD1206P100TF
Type
RUILON
Minimum package
4500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD1206P100TF
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.033g
Electronic Component
3.6mm
Electronic Component
0.8mm
Electronic Component
1
Electronic Component
300ms
Electronic Component
BM0238771548
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206P100TF 产品概述

一、产品简介

SMD1206P100TF 是 RUILON(瑞隆源)推出的一款 1206 封装自恢复聚合物保险(PPTC),标称工作电压 6V、保持电流 1A、跳闸电流 1.8A。器件尺寸为 3.6 × 1.9 × 0.8 mm,适合表面贴装电路的过流保护与短路防护,能够在故障解除后自动恢复导通状态,适用于便携设备、电源输入与接口保护等场景。

二、主要技术参数

  • 品牌/型号:RUILON / SMD1206P100TF
  • 封装:1206(SMD)
  • 最大工作电压 Vmax:6 V
  • 最大瞬时电流 Imax:35 A
  • 保持电流 Ihold(常温):1.0 A
  • 跳闸电流 Itrip:1.8 A
  • 跳闸时间:约 300 ms(达到 Itrip 时典型动作时间)
  • 功耗 Pd:600 mW(额定功耗)
  • 初始电阻 Rmin:50 mΩ(冷态)
  • 跳断后电阻 R1max:270 mΩ(复位前后高电阻状态)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 外形尺寸:3.6 mm × 1.9 mm × 0.8 mm

三、主要特性

  • 自恢复:短路或过流后自动进入高阻限流状态,故障排除后恢复低阻态,免去更换保险丝的需要。
  • 体积小、便于贴装:1206 SMD 封装,适合自动化贴装与波峰/回流焊工艺。
  • 快速动作:在超过 Itrip 时约 300 ms 动作,能有效限制短路电流峰值。
  • 低初始电阻:50 mΩ 起,可降低正常工作下的功耗与压降。
  • 可靠性考虑:工作温度宽,适用于多数工业与消费电子环境。

四、典型应用

  • USB、电源输入与充电线路的过流保护(6V 以下系统)。
  • 摄像头、移动设备、便携式仪器的输出/输入保护。
  • 电机驱动板、传感器模块、通信设备等需要短路保护的小型电路板。
  • 替代传统不可恢复保险丝以实现维护便利性的场合。

五、选型与使用建议

  • 保持裕量:选择时确保器件 Ihold 大于正常工作电流的 1.2~1.5 倍,防止温升或环境温度变化导致误触发。
  • 漏极和热管理:Pd=600 mW 为器件在特定温度下的热允许值,长时间接近该功耗会导致升温并改变动作特性,建议留有热余量并避开热源。
  • 瞬态电流能力:Imax=35A 表示短时脉冲承受能力,不代表可长期承载,应确认脉冲持续时间与间隔符合器件规范。
  • 温度影响:高温会降低 Itrip 与 Ihold,需在高温环境下校核实际动作点。
  • 布局建议:靠近被保护电源输入端或保护点安放,减少导线/走线的额外阻抗与热集中;确保焊盘尺寸与回流工艺匹配以获得稳定焊点。

六、封装、储存与可靠性

  • 焊接兼容:推荐采用标准回流焊曲线,避免超时高温暴露;焊前遵循防潮等级与回流参数。
  • 储存条件:建议干燥、避免长时间潮湿与高温,按供应商提供的保管规范存放以防元件吸湿导致焊接缺陷。
  • 可靠性测试:建议在样机阶段进行过流、温升、循环热冲击和长期老化测试,验证在目标应用工况下的动作一致性与寿命。

总结:SMD1206P100TF 以其小体积、可自动复位和适中的动作特性,适合对体积和维护有要求的低压保护场合。在使用时应充分考虑工作电流裕量与环境温度对动作点的影响,合理布板和热管理可显著提升可靠性与使用体验。

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