WMSIC Electronic Components

RUILON RL0603E024M250K

ModelRL0603E024M250K
Package0603
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON RL0603E024M250K
Type
RUILON
Minimum package
4000

Technical parameters

Electronic Component
RUILON
Electronic Component
RL0603E024M250K
Electronic Component
1
Package
0603
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.024g
Electronic Component
1
Channel Count
Electronic Component
Cj- Capacitor
2.5pF
Electronic Component
BM0255883856
Operating Temperature
55℃~+85℃
Voltage
50V
Electronic Component
IEC 61000-4-2
Current(Ir)
10uA
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RL0603E024M250K 产品概述

一、产品简介

RL0603E024M250K 是瑞隆源(RUILON)提供的一款 0603 封装单路 ESD 压敏器件,专为对体积、结电容和响应速度有较高要求的应用设计。器件在正常工作电压下保持低泄漏,在遭受静电放电时能迅速钳位并保护后级电路,适合移动设备、接口保护与各种高密度电路板上的瞬态过电压防护。

二、主要电气参数

  • 反向截止电压 (Vrwm):24 V —— 在不触发钳位情况下的最大静态偏置电压。
  • 钳位电压:50 V(典型值,按规定测试条件测得)—— 能在瞬态冲击时将电压限制在可接受范围,保护敏感器件。
  • 反向电流 (Ir):10 μA —— 在 Vrwm 条件下的漏电流,保持系统静态功耗低。
  • 结电容 (Cj):2.5 pF —— 低寄生电容,利于高速信号线的信号完整性维护。
  • 通道数:单路 —— 适用于单线或单端信号保护。
  • 类型:ESD 压敏器件,符合 IEC 61000-4-2 ESD 防护标准要求。
  • 工作温度:-55℃ ~ +85℃。

三、封装与物理特性

  • 封装:0603(国际标准 SMD 小型封装),适合高密度表面贴装设计。
  • 适配自动贴装与回流焊工艺,可融入常规 SMT 生产流程。
  • 单路设计体积小,便于在有限空间内靠近受保护端口布局,提高保护效果。

四、典型应用场景

  • 手机、平板和可穿戴设备的外部接口(耳机、USB、充电接口等)。
  • 工业与消费类电子的信号线和控制线防护。
  • IoT 终端、传感器接口与按键/开关线路的静电防护。
  • 高速数据线(对结电容敏感的场合)需要兼顾信号完整性的系统。

五、选型与使用注意

  • 若系统直流工作电压接近或高于 24 V,应选择更高 Vrwm 等级的器件,以免长期偏置触发器件工作在钳位区。
  • 对于超级高速或极低容抗要求的射频通道,应评估 2.5 pF 是否满足带宽要求;一般数字/低频高速差分线可接受。
  • 在保护多个信号线时,可并联或配合多路保护器件使用,但需注意地线回流与寄生耦合问题。
  • 在对付强脉冲或电源浪涌时,可能需要与串联电阻、滤波或更大能量吸收器件配合使用以分担能量。

六、PCB 布局与焊接建议

  • 将器件尽量靠近受保护的连接器或器件引脚放置,减少未保护段的走线长度。
  • 提供良好的接地回流路径:若为单端到地的保护方式,地平面或地焊盘应尽可能靠近,以缩短回流环路。
  • 对于差分线保护,注意对称布置,以减少对信号平衡的影响。
  • 采用厂商建议的回流焊曲线及 0603 封装焊接规范,避免过热或快速冷却导致焊接缺陷。

七、可靠性与环境特性

  • 工作温度范围宽(-55℃ 至 +85℃),适用于工业级和消费级多数环境。
  • 符合 IEC 61000-4-2 ESD 测试要求,能有效缓解接触与空气放电引起的瞬态冲击。
  • 推荐在实际应用中进行可靠性验证(ESD 重复冲击、温度循环等),以确认在目标系统中的稳定性与寿命。

八、包装与订购信息

  • 品牌:RUILON(瑞隆源)。
  • 型号:RL0603E024M250K。
  • 封装:0603 表面贴装。
  • 适合批量自动化贴装生产,具体包装卷带形式与数量请参考厂商数据表或向供应商咨询。

总结:RL0603E024M250K 将低漏电、低结电容与小体积封装结合,适用于要求靠近接口的单路 ESD 保护场合。在选型时需要关注系统工作电压与信号带宽,并按 PCB 布局建议进行安置以获得最佳防护效果。

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