WMSIC Electronic Components

RUILON SMD1812P110TF/33 SMD1812P110TF

ModelSMD1812P110TF/33
Package1812
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD1812P110TF / 33
Type
RUILON
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD1812P110TF/33
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.096g
Electronic Component
4.73mm
Electronic Component
1.3mm
Electronic Component
1
Electronic Component
300ms
Electronic Component
BM0209672266
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1812P110TF/33 — RUILON(瑞隆源) 33V 1.1A 1812 自恢复保险器 产品概述

一、产品简介

SMD1812P110TF/33 为 RUILON(瑞隆源)出品的表面贴装自恢复保险器(PTC resettable fuse),封装尺寸为1812,专为中低电压系统的过流保护设计。器件能在过电流发生时自动跳闸限制电流,并在故障清除后自行恢复,适合需要重复保护且维护不便的电子设备。

二、主要技术参数

  • 品牌:RUILON(瑞隆源)
  • 型号:SMD1812P110TF/33
  • 额定耐压 Vmax:33 V
  • 保持电流 Ihold:1.1 A
  • 跳闸电流 Itrip:2.2 A
  • 最大允许电流 Imax(峰值短时):35 A
  • 初始态阻值 Rmin:50 mΩ
  • 跳闸后阻值 R1max:250 mΩ
  • 消耗功率 Pd:800 mW(常温参考)
  • 动作时间:300 ms(在规定过电流下)
  • 尺寸:长 4.73 mm × 宽 3.41 mm × 高 1.3 mm(1812)
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、产品特性与优势

  • 自恢复保护:发生过流或短路时迅速限制电流,故障消除后能自动恢复,无需更换器件,降低维护成本。
  • 低通态阻值:初始阻值低(约50 mΩ),对正常工作电路压降和发热影响小。
  • 明确动作特性:保持电流与动作电流分离(1.1 A / 2.2 A),便于按电路工作电流选型。
  • 紧凑封装:1812 SMD 体积小,适合集成到自动贴片工艺中。
  • 宽温工作:-40 ℃ 至 +85 ℃,适用于多数商业及工业环境。

四、典型应用场景

  • 电源管理与输入保护(例如 12V/24V 系统、33V 上限电路)
  • LED 驱动与照明设备过流保护
  • 通信与网络设备的端口保护
  • 电池组与便携设备的线路保护
  • 工业控制与消费电子的板级保护

五、选型与使用建议

  • 确定 Ihold:器件应选型使正常最大工作电流小于 Ihold(1.1 A),避免工作中自发跳闸。若有较大浪涌电流,需确认是否为短时峰值并在热量容许范围内。
  • 考虑环境温度:高环境温度会降低跳闸门槛,必要时选用更高规格或增加热隔离与散热。
  • 布局与散热:器件对温度敏感,PCB 布局应避免紧邻大功率发热元件,并适当设计焊盘与铜箔以利散热。
  • 焊接兼容性:适用于常规 SMT 回流工艺,但建议参考厂方资料确认回流曲线与最大焊接温度。
  • 验证应用:在目标应用中进行实际温升与动作验证,确认在最大故障情形下器件行为满足系统保护要求。

六、封装与可靠性

1812 封装(4.73 × 3.41 × 1.3 mm)便于自动化生产与高密度布板。器件经过过流动作测试与温循测试后具备可重复使用性,但长时间频繁跳闸可能影响寿命和阻值特性,建议在系统级设计中避免持续过载工况。

如需完整电气特性曲线、典型热特性图或样品测试报告,请联系 RUILON(瑞隆源)或当地代理获取详细数据手册与技术支持。

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