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RUILON SMD0603P075TF
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RUILON SMD0603P075TF
- Type
- RUILON
- Minimum package
- 4000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RUILON
- Electronic Component
- SMD0603P075TF
- Electronic Component
- 1
- Electronic Component
- 1.05mm
- Package
- 0603
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.024g
- Electronic Component
- 1.85mm
- Electronic Component
- 1.15mm
- Electronic Component
- 1
- Electronic Component
- 100ms
- Electronic Component
- BM0257667355
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 6V
- Power(Pd)
- 500mW
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMD0603P075TF 产品概述
一、产品简介
SMD0603P075TF（品牌：RUILON/瑞隆源）是一款表面贴装型自恢复保险丝（PTC resettable fuse），采用0603封装，用于低压电路的过流/短路保护。该器件在正常工作时保持低阻抗以减小压降，遇过流时迅速升温增阻限流，故障解除后可自动恢复。
二、主要参数
- 最大耐压（Vmax）：6 V
- 最大允许电流（Imax）：35 A（短时浪涌）
- 保持电流（Ihold）：0.75 A
- 跳闸电流（Itrip）：1.4 A
- 功耗能力（Pd）：500 mW
- 初始态阻值（Rmin）：60 mΩ
- 跳断后阻值上限（R1max）：450 mΩ
- 动作时间：100 ms（典型，受温度和电流波形影响）
- 工作温度：-40 ℃ ~ +85 ℃
- 封装尺寸：0603；长1.85 mm × 宽1.05 mm × 高1.15 mm
三、特性亮点
- 低初始阻值（60 mΩ）保证在0.75 A工作时的功耗极小（约34 mW），适合对压降敏感的电源轨。
- 快速动作（约100 ms）可在短时间内限制过流，保护后级元件和电路。
- 自动复位特性，消除更换熔断器的人工维护需求，提升产品可靠性与可维护性。
- 紧凑0603外形，适合空间受限的消费电子与便携设备。
四、典型应用场景
- USB、移动电源与充电器的过流保护（限于 ≤6 V 系统）
- 电池供电设备的输出短路保护
- IoT、可穿戴设备、便携式音视频产品的电源轨防护
- LED驱动、小功率电机驱动及低压模块的保护
五、设计与布局建议
- 建议将器件靠近受保护电源引出端放置，减少未保护段长度。
- 注意PCB铜皮面积与厚度对热散的影响：较大铜量会提高散热，可能导致跳闸电流偏高；设计时需考虑环境温度和周围元件热源。
- 遵循制造商的回流焊工艺建议，避免过热损伤器件。
- 对于重复出现的大电流浪涌（接近或超过 Imax）的场合，应评估器件寿命并考虑并联或采用专用限流方案。
六、可靠性与使用注意
- Imax 为短时浪涌能力，频繁或长时超过该值会损坏器件或造成不可逆变化。
- 器件动作特性受环境温度影响：高温环境会降低跳闸电流，低温环境则相反，设计时需留有余量。
- 跳断后阻值上限为450 mΩ，在故障条件下电压降与发热会明显增大，应尽快排查并消除故障以避免长期高温工作。
结论：SMD0603P075TF 是一款适用于低压（≤6 V）、中等持续电流（≤0.75 A）场合的紧凑型可复位保险保护元件，适合对体积、维护与成本有较高要求的消费类和便携式电子产品。选择与布局时应综合考虑环境温度、PCB热量与短时浪涌特性。
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