Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RUILON SMAJ18CA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RUILON SMAJ18CA
- Type
- RUILON
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RUILON
- Electronic Component
- SMAJ18CA
- Electronic Component
- 1
- Package
- DO-214AC
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.1g
- Electronic Component
- 1
- Electronic Component
- BM0264533065
- Operating Temperature
- 55℃~+150℃
- Voltage
- 29.2V
- Electronic Component
- IEC 61000-4-4；IEC 61000-4-2
- Current(Ir)
- 1uA
- Voltage(VBR)
- 23.3V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMAJ18CA（RUILON瑞隆源）TVS瞬态抑制二极管产品概述
SMAJ18CA是瑞隆源（RUILON）推出的一款双向瞬态抑制二极管（TVS），专为电子系统中的过压防护设计，可快速响应瞬态脉冲干扰，保护敏感电路免受静电放电（ESD）、电快速瞬变脉冲群（EFT）等破坏，广泛应用于消费电子、工业控制、通信及汽车电子等领域。
一、核心电气参数与防护能力
该产品的电气参数针对常见瞬态干扰场景优化，关键参数解析如下：
- 反向截止电压（Vrwm）：18V，为产品允许的最大直流工作电压，正常工作时不会触发导通，不影响电路常规信号传输；
- 钳位电压：29.2V（典型值），当遭遇瞬态脉冲时，TVS会快速击穿并将电压钳位在此水平，避免后端电路过压损坏；
- 峰值脉冲功率（Ppp）：400W（@10/1000μs脉冲波形），可承受短时间内的高能量脉冲冲击；
- 峰值脉冲电流（Ipp）：13.7A（同波形下），对应400W功率的最大脉冲电流能力，满足多数接口的防护需求；
- 反向击穿电压：23.3V（典型值），为TVS反向导通的起始电压，确保在过压发生时快速响应；
- 反向漏电流（Ir）：1μA（最大），低漏电流设计可降低静态功耗，避免对电路造成额外负载。
二、封装与环境适应性
SMAJ18CA采用DO-214AC封装（俗称SMA封装），尺寸小巧（约2.7×1.7×1.0mm），适合表面贴装工艺（SMD），可直接集成于高密度PCB板中，节省空间。
环境适应性方面，产品支持**-55℃~+150℃**的宽温工作范围，覆盖工业级、汽车级等严苛温度场景，可靠性符合高低温循环测试要求。
三、防护标准与应用场景
1. 标准符合性
产品通过**IEC 61000-4-2（ESD防护）和IEC 61000-4-4（EFT防护）**认证，可有效应对：
- 静电放电（接触放电8kV、空气放电15kV及以上）；
- 电快速瞬变脉冲群（±2kV/5kHz及以下）。
2. 典型应用
- 消费电子：手机、平板、笔记本电脑的USB、HDMI等接口防护；
- 工业控制：PLC模块、传感器、电机驱动电路的过压防护；
- 通信设备：路由器、交换机、基站的以太网端口、射频接口防护；
- 汽车电子：车载显示屏、辅助驾驶传感器的瞬态干扰防护（宽温适配车载环境）。
四、产品优势总结
- 双向防护：无需区分正负极，简化电路设计，适合双向信号传输的接口防护；
- 快速响应：TVS的响应时间仅为纳秒级，可瞬间抑制瞬态脉冲；
- 宽温可靠：-55℃~+150℃工作范围，满足高低温场景需求；
- 小封装集成：DO-214AC封装适合高密度PCB，降低系统体积；
- 高可靠性：符合国际防护标准，低漏电流设计提升电路稳定性。
SMAJ18CA凭借双向防护、宽温适配及高脉冲耐受能力，成为电子系统过压防护的高性价比选择，可有效提升设备的抗干扰性能与使用寿命。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
