WMSIC Electronic Components

RUILON P0080SB

ModelP0080SB
PackageSMB
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON P0080SB
Type
RUILON
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
P0080SB
Electronic Component
1
Package
SMB
Electronic Component
Thyristor Surge Suppressor (TSS)
Electronic Component
0.232g
Current
5uA
Electronic Component
1
Electronic Component
BM0257675645
Operating Temperature
40℃~+150℃
Latching Current(Ih)
50mA
Switch Voltage(Vs)
25V
Capacitor(Co)
60pF
Voltage(Vt)
4V
Current(It)
2.2A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

P0080SB 产品概述

一、产品简介

P0080SB 是 RUILON(瑞隆源)推出的一款表面贴装功率开关/保护器件(SMB 封装),用于承受短时脉冲电流并提供稳健的开关/保护特性。产品数据已校验通过,适合对浪涌、脉冲及低压触发场景的工程应用。

二、主要参数

  • 断态峰值电压 (Vdrm):6 V
  • 开关(触发)电压 (Vs):25 V
  • 峰值脉冲电流 (Ipp):80 A
  • 漏电流:5 μA
  • 保持电流 (Ih):50 mA
  • 通态电压 (Vt):4 V
  • 通态电流 (It):2.2 A
  • 断态电容 (Co):60 pF
  • 工作温度范围:-40 ℃ 至 +150 ℃
  • 品牌:RUILON(瑞隆源)
  • 封装:SMB

三、性能特点

  1. 强抗浪涌能力:80 A 峰值脉冲电流指标,能够承受短时高能量冲击,适用于瞬态事件较多的环境。
  2. 低漏电与低断态电容:5 μA 的漏电流和 60 pF 的断态电容,有利于降低静态损耗和提高高频响应性能。
  3. 明确的保持与通态特性:50 mA 的保持电流与 4 V 的通态电压为电路设计提供稳定的工作区间,便于与驱动电路匹配。
  4. 宽温度工作范围:-40 ℃ 至 +150 ℃,适合工业及车规级等较恶劣环境。

四、典型应用场景

  • 浪涌抑制与短时过压保护电路
  • 脉冲开关与触发电路(需承受高峰值脉冲)
  • 电源保护模块、逆变器与驱动板的保护单元
  • 工业控制与通信设备中需要高可靠性、低漏电的场合

五、封装与可靠性

SMB 表面贴装封装适配自动化贴装与回流焊工艺,有利于产线制造与散热布局。器件的高温工作上限可达 150 ℃,在板上合理布线与热设计下可保证长期稳定运行。

六、使用建议与注意事项

  • 在设计中预留足够的热散条件,避免长时间高电流导致器件过热。
  • 根据保持电流与通态电压选择合适的驱动电路,确保开关动作稳定可靠。
  • 对于频繁高能脉冲场合,建议进行完整的热冲击与寿命验证。
  • 在 SMT 贴装时遵循厂方回流焊温度曲线,防止封装应力和性能退化。

七、总结

P0080SB 是一款定位于脉冲耐受与可靠开关保护的 SMB 封装器件,凭借 80 A 峰值脉冲能力、低漏电与宽温度范围,适合工业级与消耗功率受限的应用场景。器件信息已校验通过,建议在具体方案中结合热设计与驱动策略进行验证以达到最佳性能。

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