WMSIC Electronic Components

RUILON SMBJ60A

ModelSMBJ60A
PackageSMB
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMBJ60A
Type
RUILON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMBJ60A
Electronic Component
1
Package
SMB
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.199g
Electronic Component
1
Electronic Component
BM0258852129
Operating Temperature
55℃~+150℃
Voltage
96.8V
Current(Ir)
1uA
Voltage(VBR)
73.7V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMBJ60A (RUILON·瑞隆源) — 单向 TVS 二极管 产品概述

一、概述

SMBJ60A 是 RUILON(瑞隆源)推出的一款单向瞬态电压抑制器(TVS),采用 SMB 封装,专为抑制瞬态过电压和浪涌脉冲设计。该器件在工业、通信、电源与车载等对抗电压尖峰和浪涌能力有要求的系统中,提供快速钳位、低反向漏电的保护性能,能有效保护敏感半导体器件免受瞬态冲击损坏。

二、主要参数

  • 极性:单向
  • 反向截止电压 Vrwm:60 V
  • 钳位电压 Vc(Ipp 条件):96.8 V
  • 峰值脉冲电流 Ipp:6.2 A(10/1000 μs 波形)
  • 峰值脉冲功率 Ppp:600 W(10/1000 μs)
  • 击穿电压 VBR:73.7 V(典型或标称)
  • 反向电流 Ir:1 μA(在 Vrwm 条件下)
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SMB(表面贴装)
  • 型号:SMBJ60A,品牌:RUILON(瑞隆源)

三、关键特性与优势

  • 高能量吸收:10/1000 μs 条件下可承受 600W 峰值功率,适合中等能量浪涌抑制。
  • 有效钳位:96.8V 的钳位电压在 60V 工作电压系统异常时能快速钳制峰值,减少后级负载暴露电压。
  • 低漏电流:在正常工作电压下反向电流仅 1 μA,利于低功耗系统设计。
  • 宽温度范围:-55~+150℃ 满足工业及部分严苛环境应用。
  • SMB 封装:便于自动贴片工艺,散热与焊接可靠。

四、典型应用

  • 48V~60V 直流电源与配电保护(如基站、服务器电源)
  • 工业控制与自动化设备的输入防护
  • 通信设备、交换机、路由器电源端口防雷浪涌
  • 电池管理与逆变器外围保护(注意选型需匹配系统电压与能量等级)
  • 需要中等能量脉冲抑制的消费与车载电子(使用前确认车规兼容性)

五、使用与选型建议

  • 确认系统最大连续工作电压 ≤ Vrwm(60V),否则会引起持续导通或损坏。
  • 钳位电压 96.8V 为峰值钳位,需评估后级器件能否承受该瞬时值。
  • 浪涌能量按 10/1000 μs 波形标定,若系统遭遇更尖锐(e.g., 8/20 μs)或更高能量冲击,应核算等效能量并考虑并联/更高等级器件。
  • 布局建议:TVS 尽量靠近需保护引脚放置,最短且宽的接地回路以减少寄生电感。
  • 热管理:在频繁冲击或高温环境下注意器件自热与焊盘散热设计,必要时采用更高功率等级产品。

六、封装与可靠性

SMB 封装兼顾尺寸与散热,适配常规 SMT 生产线。工作温度覆盖工业级要求,长期可靠性受焊接工艺、散热与实际冲击频率影响。订购时建议确认批次与可靠性测试报告(如有特定车规或高可靠性需求,向供应商索取详细认证资料)。

如需替代型号建议或在具体电路中计算钳位电压/剩余能量,请提供工作电压、最大容许钳位值及预期浪涌波形,我可帮助进一步选型与布局优化。

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