WMSIC Electronic Components

RUILON SMD1206P050TF/30 SMD1206P050TF

ModelSMD1206P050TF/30
Package1206
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD1206P050TF / 30
Type
RUILON
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD1206P050TF/30
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.034g
Electronic Component
3.6mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0264391788
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
600mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206P050TF/30 产品概述 — RUILON (瑞隆源)

一、产品简介

SMD1206P050TF/30 是 RUILON(瑞隆源)推出的一款微型 1206 封装表面贴装过流保护器件,适用于空间受限的现代电子产品。该器件属于自恢复型过流保护元件(PTC 热敏保险/聚合物压敏复合体),在正常工作时保持低阻抗,遇短路或过流时在短时间内跳闸并限制电流,故障消除后可自动恢复导通状态。典型应用包括移动设备、便携式电源、USB/外设保护、LED 驱动与小型电源管理电路等。

二、主要参数(关键规格)

  • 最高耐压(Vmax):30 V
  • 最大瞬时电流(Imax):35 A
  • 保持电流(Ihold):0.50 A(500 mA)
  • 跳闸电流(Itrip):1.0 A
  • 功耗(Pd):600 mW
  • 初始阻值(Rmin,未触发):150 mΩ
  • 跳断后阻值(R1max):700 mΩ
  • 动作时间:100 ms(典型)
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 尺寸 / 封装:1206(3.6 mm × 1.9 mm × 1.0 mm)
  • 品牌:RUILON(瑞隆源)

三、产品特性与优势

  • 小型化封装:1206 尺寸适合高密度 PCB 布局,节省空间。
  • 低导通阻抗:初始阻值仅 150 mΩ,能在保证保护的同时将正常工作时的压降和发热降到最低。
  • 快速响应:约 100 ms 的动作时间可迅速限制过流,保护后级电路和元器件。
  • 自恢复能力:过流故障消除后自动恢复导通,免除更换保险丝的维护成本。
  • 宽温度范围:-40 ℃ 至 +85 ℃,适应多种环境和应用场景。
  • 高浪涌承受能力:最大瞬时电流 35 A,能够承受短时间高幅值浪涌冲击。

四、典型应用场景

  • 移动设备与消费电子:智能手机充电线、平板、移动电源的输出保护。
  • USB 端口与外设:USB-VBUS 过流保护、数据线或外设供电保护。
  • LED 与照明:小功率 LED 驱动模块短路与过流保护。
  • 便携式仪器与测控设备:保护低压 DC 供电轨与外接设备接口。
  • 其它空间受限、对可靠性有要求的电源保护场合。

五、选型与设计建议

  • Ihold 的选择:常规做法是将器件的保持电流 Ihold 设定略高于系统的正常工作电流,建议留有 20%~50% 余量,以避免误动作。对于静态或峰值较大的负载,应评估平均与峰值电流对器件的影响。
  • Itrip 的判断:跳闸电流 Itrip 应小于系统允许的最大故障电流,同时要确保在该电流下器件能在规定时间内动作以保护后级电路。
  • 温度与散热:器件的保持电流与动作特性与环境温度密切相关,高温会降低有效保持电流,设计时需考虑环境温度对保护性能的影响。
  • 浪涌能力:Imax 为器件在短时间内可承受的峰值电流,应避免频繁接近或超过该值以延长寿命。

六、PCB 布局与焊接建议

  • 放置位置:将过流保护器件靠近被保护回路的电源输入端布置,以最小化暴露的导线或走线长度,提高保护效果。
  • 热管理:避免将器件放在强热源附近,合理安排铜皮面积以利散热;对于需要更好散热的场合,可增大焊盘或填铜。
  • 回流焊兼容:SMD 1206 封装兼容主流回流焊工艺,但建议参考厂家提供的回流焊曲线资料,遵循推荐的温度与时间参数以保证焊接可靠性。
  • 贴装与检测:表面贴装时注意避免过度机械应力,焊后可通过目检与阻值测量确认元件完整性。

七、可靠性与使用注意事项

  • 常态下,器件为低阻态,但在重复高温或频繁大电流触发情况下,性能可能出现漂移,应在设计中预留冗余或做定期验证。
  • 对于关键安全应用,建议配合电流限流或熔断器作为二次保护手段,以构建冗余保护体系。
  • 使用前请审阅 RUILON 提供的完整规格书(Datasheet),确认各项典型曲线(温度系数、I-T 曲线、功耗曲线等)以便进行精确设计。

八、结论

SMD1206P050TF/30 以其小型化的 1206 封装、低导通阻抗与快速自恢复保护特性,适合在空间受限且要求可靠过流保护的低压电子系统中使用。合理选型与良好的 PCB 布局、热管理可以充分发挥其保护性能,提升整机的抗故障能力与使用寿命。欲获取更加详细的电气曲线与应用参考,请联系 RUILON(瑞隆源)或查询原厂规格书。

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