WMSIC Electronic Components

RUILON SMD2920P250TF

ModelSMD2920P250TF
Package2920
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD2920P250TF
Type
RUILON
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD2920P250TF
Electronic Component
1
Electronic Component
5.44mm
Package
2920
Electronic Component
Resettable Fuse
Electronic Component
0.196g
Electronic Component
7.98mm
Electronic Component
1.4mm
Electronic Component
1
Electronic Component
16s
Electronic Component
BM0258851930
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
1.5W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD2920P250TF 产品概述

一、产品简介

SMD2920P250TF 是 RUILON(瑞隆源)出品的一款表面贴装自恢复熔断器(PTC resettable fuse),封装型号为 2920,适用于中低压、过流保护的消费电子与工业电子设备。该器件在过流情况下自动进入高阻态以限制电流,故障消除后可自动恢复初始低阻态,具有可重复保护能力,便于维护与设计简化。

二、主要参数

  • 额定耐压(Vmax):16 V(推荐工作电压不超过 15 V)
  • 最大通过电流(Imax):40 A
  • 保持电流(Ihold):2.5 A(在环境温度与贴装条件下连续不动作的最大电流)
  • 跳闸电流(Itrip):5 A(器件在规定条件下进入高阻态的典型触发电流)
  • 功率消耗(Pd):1.5 W(器件在一定电流下的热功耗指标)
  • 初始态电阻(Rmin):20 mΩ
  • 跳断后最大电阻(R1max):85 mΩ
  • 动作时间:16 s(在标称过流条件下达到跳闸所需的典型时间)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 尺寸:长度 7.98 mm,宽度 5.44 mm,高度 1.4 mm
  • 封装:2920 SMD

三、核心特性

  • 自恢复功能:过流导致内部温升,电阻迅速上升限制电流;故障消除后冷却复位,无需更换元件。
  • 低初始电阻:20 mΩ 的低并联损耗,适合对压降敏感的电源回路与电池保护。
  • 高承受能力:40 A 的瞬间电流承受能力,适合短路冲击与启动涌流场景。
  • 宽温度工作范围:-40~+85 ℃,适合多种环境条件下长期可靠工作。
  • 封装利于自动化贴装,尺寸 2920 兼顾热散与占板空间。

四、典型应用

  • 移动电源、平板与笔记本电池保护与输出端保护
  • USB、充电器与车载电子过流保护
  • 工业控制模块、电源管理板与逆变器辅助保护
  • 需要重复过流保护且对维护便捷性有要求的嵌入式设备

五、选型与使用建议

  • 确定额定工作电流时,应将实际工作电流低于 Ihold,以避免长期发热导致误动作;若存在较大短时涌流,应考虑器件的 Imax 能力与动作时间特性。
  • PCB 布局应注意散热,增加铜箔面积有利于降低器件表面温升,延长寿命与稳定性能。
  • 在高温环境或长期接近 Ihold 条件下,应留有裕度选择更高 Ihold 的型号或提高器件规格。
  • 与其他保护元件(如快断保险丝、TVS)配合使用可获得更完善的防护策略。

六、封装与可靠性说明

2920 封装便于贴片生产,体积小巧但具有良好热容量。推荐在回流焊工艺参数下进行验证,避免超过封装允许的热循环次数。符合工业级温度规格,适合长期批量生产与可靠性要求较高的应用场景。

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