Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RUILON SMFJ6.5A
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RUILON SMFJ6.5A
- Type
- RUILON
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RUILON
- Electronic Component
- SMFJ6.5A
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0264391769
- Operating Temperature
- 55℃~+150℃
- Voltage
- 11.2V
- Current(Ir)
- 50uA
- Voltage(VBR)
- 7.98V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMFJ6.5A 产品概述
一、产品简介
SMFJ6.5A 是 RUILON（瑞隆源）推出的一款单向瞬态电压抑制器（TVS），专为保护敏感电子设备免受雷击、开关瞬变及其他瞬时过电压事件影响而设计。器件采用紧凑的 SOD-123FL 封装，封装高度仅 1.1 mm，与传统 SMA 相比，占位面积减少约 50%，非常适合空间受限的便携式与高密度电路板应用。
二、主要电气参数
- 极性：单向（Unidirectional）
- 反向工作电压 Vrwm：6.5 V
- 击穿电压 VBR：7.98 V（典型）
- 钳位电压（Ipp 条件下）：11.2 V
- 峰值脉冲电流 Ipp：17.8 A（10/1000 μs）
- 峰值脉冲功率 Ppp：200 W（10/1000 μs）
- 反向漏电流 Ir：50 μA（常温下）
- 工作温度范围：-55 ℃ 至 +150 ℃
这些参数表明 SMFJ6.5A 对于 5 V/6 V 级别电源和信号线提供高效的瞬态能量吸收和钳位保护，同时在高温环境下仍保持可靠性能。
三、典型应用场景
- USB、以太网和串行接口的瞬态保护
- 5 V/6 V 电源轨与外围模块保护
- 工业控制与仪表中的输入/输出防护
- 通信设备、路由器及终端设备的防雷与浪涌抑制
四、封装与布局建议
SOD-123FL 小尺寸低高度的特点适合高密度 PCB 布局。为获得最佳保护效果，应遵循以下布局要点：
- 将 TVS 器件尽可能靠近受保护的输入端或电源入口放置，缩短走线长度以降低感性耦合。
- 使用较宽的铜箔和适量过孔以改善热量分散能力，特别是在频繁遭受脉冲能量的环境中。
- 对于敏感信号线，配合串联阻抗或滤波网络使用，可提升系统整体抗扰度。
五、可靠性与使用注意
SMFJ6.5A 的工作温度范围为 -55 ℃ 至 +150 ℃，适合苛刻环境下长期工作。实际应用时应注意：
- 尽量避免在超出器件峰值脉冲能量的条件下重复冲击，以免影响器件寿命。
- 在设计中评估系统可能遭遇的最大浪涌能量，必要时并联更高能量等级的保护器件或增加外部限流元件。
- 考虑到 50 μA 的漏电流，对于超低功耗或高阻输入场合需评估对系统偏置的影响。
六、优势总结
- 高能量吸收能力（200 W@10/1000 μs）和较高峰值脉冲电流（17.8 A），有效抑制大多数工业与通信环境下的瞬态脉冲。
- SOD-123FL 超小封装与 1.1 mm 的低高度设计，显著节省 PCB 面积并利于 SMT 自动化生产。
- 宽温度范围与低漏电流特性，适配多种工作环境与应用需求。
如需样片、封装尺寸图或在特定波形下的钳位曲线和测试条件，请联系 RUILON（瑞隆源）或其授权分销商获取详细数据手册与测试报告。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
