WMSIC Electronic Components

RUILON SMD1812P150TF/24 SMD1812P150TF

ModelSMD1812P150TF/24
Package1812
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD1812P150TF / 24
Type
RUILON
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD1812P150TF/24
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.096g
Electronic Component
4.73mm
Electronic Component
1.1mm
Electronic Component
1
Electronic Component
500ms
Electronic Component
BM0238781029
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1812P150TF/24 产品概述

一、产品简介

SMD1812P150TF/24 是 RUILON(瑞隆源)推出的一款 1812 封装自恢复保险丝(聚合物正温度系数 PTC),额定系统电压 24V,保持电流 1.5A,适用于24V系统的过流保护与复位保护。器件在过流或短路情况下自动增阻限流并在故障清除后自行恢复,适合要求频繁保护动作后快速恢复的场合,减小维护成本并保护系统器件。

二、主要性能参数

  • 额定耐压(Vmax):24 V
  • 最大允许电流(Imax):35 A
  • 保持电流(Ihold):1.5 A(器件在长期允许范围内的稳态电流)
  • 跳闸电流(Itrip):3 A(器件进入高阻态的典型触发电流)
  • 功耗(Pd):800 mW
  • 初始态阻值(Rmin):40 mΩ(常温、未动作时)
  • 跳断后阻值(R1max):160 mΩ(动作后限制电流时的高阻态上限)
  • 动作时间:500 ms(达到跳闸条件所需的典型时间)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 外形尺寸(典型):长 4.73 mm × 宽 3.41 mm × 高 1.10 mm
  • 封装:1812 表面贴装

三、产品特点与优势

  • 自动复位:过流消除后器件阻值恢复,免去更换熔断器的麻烦;
  • 体积小、表贴化:1812 SMD 封装,便于自动贴装与回流焊接,适合集成化设计;
  • 快速响应:在超过 Itrip 的条件下能在典型 500 ms 级别动作,保护敏感负载;
  • 低初始电阻:初始态仅 40 mΩ,正常工作时压降与发热小;
  • 宽温工作:-40~85 ℃ 满足工业级与车规级环境要求(使用时请结合系统热设计);
  • 高通过电流能力:Imax 达 35 A,能承受瞬态大电流冲击(需注意热与能量限制)。

四、典型应用场景

  • 24V 汽车/商用车电源总线过流保护;
  • 工业控制设备、PLC、驱动模块输入保护;
  • 电源适配器、分配板的输出短路防护;
  • 通信及基站设备、仪器仪表等要求自动复位的场合;
  • 需要频繁保护动作且不便人工更换保险的系统。

五、选型与使用注意事项

  • 选择时以工作电流(实际工况电流)低于 Ihold 为基本原则,若系统存在长期脉冲或启动浪涌,请参考器件在不同温度下的 I–T 特性并保留余量;
  • 环境温度高会降低器件持流能力,应进行热降额(derating)设计并避免在器件上方形成散热障碍;
  • 流经器件的持续功耗不应超过 Pd(800 mW),否则将导致温升和误动作;
  • 在回流焊接工艺中一般兼容常见 SMD 回流温度曲线,但具体焊接峰值需参考厂方建议并验证,避免过高温度或长时间加热;
  • 布局时两端焊盘及走线应尽量短且宽以减少额外阻抗与发热;在高可靠性系统可并联多只相同型号以提高通过电流与热分摊(需注意并联均流问题)。

六、封装与可靠性

SMD 1812 标准封装,尺寸 4.73×3.41×1.10 mm,适配常见 1812 封装封装孔位与 PCB 阵列。RUILON 出品,按照聚合物 PTC 的常规工程规范制造,具备较好的循环动作稳定性与环境寿命。具体可靠性测试(如高温储存、热循环、冲击振动)和寿命数据请参考厂方完整技术资料或向供应商索取认证报告进行验证。

如需针对具体电路进行选型建议(含 I–T 曲线、环境降额计 算、PCB 过流试验方法)或获取封装推荐 PCB 阵位图,请提供工作电流、峰值脉冲特性与应用环境温度,我可协助进一步分析。

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