WMSIC Electronic Components

RUILON S8050-HQ S8050

ModelS8050-HQ
PackageSOT-23
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON S8050-HQ
Type
RUILON
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
S8050-HQ
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0259279734
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
150MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

S8050-HQ 产品概述

一、产品简介

S8050-HQ(RUILON/瑞隆源)是一款面向通用小功率场合的NPN晶体管,采用SOT-23小封装,单只供应(数量:1个)。器件在保持小封装体积的同时,具备高直流增益与较高的特征频率,适合开关驱动与小信号放大等应用。

二、关键性能指标

  • 晶体管类型:NPN
  • 最大集电极电流 Ic:500mA
  • 集—射极击穿电压 Vceo:25V
  • 最大耗散功率 Pd:300mW(封装及PCB散热相关,应参考厂商曲线并按环境温度降额)
  • 直流电流增益 hFE:120(条件:Ic=500mA,Vce=1.0V)
  • 特征频率 fT:150MHz(适合较高频率的小信号放大)
  • 集电极截止电流 Icbo:100nA(漏电流小,有利于低功耗场合)
  • 集—射极饱和电压 VCE(sat):600mV(测试条件:Ic=500mA/50mA,基极驱动需满足)
  • 射—基极击穿电压 Vebo:5V(注意基极电压不宜超过该值)
  • 工作温度范围:-55℃ ~ +150℃

三、主要特性与优势

  • 高增益:在大电流工作点仍有约120的hFE,有利于减少基极驱动电流,用于电流放大或驱动级效果显著。
  • 高频性能良好:fT=150MHz,适合音频高端、射频前端或快速开关场合的信号处理。
  • 低漏电流:Icbo约为100nA,适用于要求低静态电流的便携式与电池供电设备。
  • 小封装、便于贴装:SOT-23占板面积小,适合空间受限的电路板设计。

四、典型应用场景

  • 模拟信号前置放大、驱动级放大;
  • 小型电机或继电器低压驱动(需注意Pd和散热);
  • 开关电路、脉冲驱动;
  • 便携设备与低功耗控制电路;
  • 高频小信号放大与混频前端(非高功率RF端)。

五、设计与选型建议

  • 散热与功率限制:SOT-23封装下Pd仅300mW,长时间高电流工作需关注PCB铜箔散热、增加散热面或选用更大封装的器件。建议在高温环境下按厂商温度降额曲线使用。
  • 饱和与开关:在做开关应用时,VCE(sat)约600mV(500mA条件下),驱动基极时需保证足够的基极电流以降低饱和电压。
  • 基极电压保护:基极对射极击穿电压Vebo为5V,应通过限流或钳位电路避免超压。
  • 电压与极限:集电极-射极电压Vceo 25V,应用中应保证不会超过此电压极限。
  • 引脚与封装:SOT-23引脚排列和电气参数请以厂商数据手册为准,实际布局参考推荐的PCB焊盘和过孔设计。

六、可靠性与注意事项

  • 储存与焊接:遵循无铅回流温度规范,避免长时间高温曝露。
  • 静电防护:器件对静电敏感,装配和测试时建议采取ESD防护措施。
  • 测试条件差异:器件参数随测试条件变化明显,设计时请参考完整数据手册和典型电路图以获得准确的行为预估。

总结:S8050-HQ在小封装下提供了良好的增益与频率特性,适合多种通用放大与开关场合。选型时重点关注功耗与散热限制、基极保护与最大电压边界,以确保可靠运行。欲获取引脚定义、详细特性曲线及典型应用电路,请参阅RUILON(瑞隆源)官方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.