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RUILON B5819WS SOD-323 B5819WS
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RUILON B5819WS SOD-323
- Type
- RUILON
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RUILON
- Electronic Component
- B5819WS SOD-323
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0238788237
- Current
- 1A
- Diode
- Electronic Component
- Current(Ir)
- 1mA@40V
- (Vf)
- 600mV
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
B5819WS SOD-323 产品概述
一、产品简介
B5819WS（品牌：RUILON/瑞隆源）为独立式肖特基整流二极管，采用SOD-323小体积贴片封装。器件设计用于中低功率整流与保护应用，兼顾体积与开关性能，适合空间受限的表面贴装电路。
二、主要参数
- 正向压降（Vf）：约600 mV（典型值，通常在1 A工况参考）
- 直流反向耐压（Vr）：40 V
- 额定整流电流：1 A（平均）
- 反向电流（Ir）：1 mA @ 40 V
- 非重复峰值浪涌电流（Ifsm）：9 A（单次冲击）
三、特性与优势
该器件正向压降低，有利于提高整流效率并减少功耗。SOD-323小封装占板面积小，适合高密度布局。浪涌能力允许短时充放电或启动电流出现时器件承受较大冲击。典型反向漏电在高压端有一定值，需在设计中考虑。
四、典型应用场景
适用于开关电源输出整流、反向保护、续流二极管、USB/便携设备电源路径管理、车载低压系统（受限于40 V反向耐压）以及一般功率整流与保护电路。
五、封装与热性能
SOD-323属小型塑料贴片封装，焊接面积有限，器件热阻较大。长期1 A工作或频繁高峰值条件下需注意PCB散热设计，建议增加铜箔面积或使用散热通孔以降低结温。
六、PCB布局与使用建议
- 近源地布局，缩短电流回路，减少串联电阻与寄生感抗。
- 为降低结温，适当扩大焊盘铜皮并添加散热过孔。
- 对于高反向电流场合，评估环境温度对漏电的影响并选型余量。
- 焊接时遵循无铅回流曲线，避免超温损伤封装。
七、采购与储存建议
选择可靠渠道采购以保证原厂品质。封装对潮湿敏感，建议按MSL等级储存并在规定时间内回潮前回流焊接。大批量使用时可与供应商确认器件完整规格书与可得性。
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