WMSIC Electronic Components

RUILON SMD1206P005TF

ModelSMD1206P005TF
Package1206
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD1206P005TF
Type
RUILON
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD1206P005TF
Electronic Component
1
Electronic Component
1.9mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.033g
Electronic Component
3.6mm
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
1.5s
Electronic Component
BM0228172286
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
60V
Power(Pd)
400mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206P005TF 产品概述

一、产品简介

SMD1206P005TF 是 RUILON(瑞隆源)推出的一款 1206 封装自恢复保险元件(聚合物自恢复保险丝)。标称耐压 60V,设计用于在过流或短路情况下自动限流并在故障解除后恢复导通,适合表面贴装工艺的中低电流保护场合。

二、主要规格与电气参数

  • 耐压 (Vmax):60V
  • 最大电流 (Imax):10A
  • 保持电流 (Ihold):50mA(元件在正常工作时应小于此电流)
  • 跳闸电流 (Itrip):150mA(在该电流附近元件将在规定时间内动作)
  • 消耗功率 (Pd):400mW(在稳态下的最大耗散能力)
  • 初始态阻值 (Rmin):1.6Ω
  • 跳断后阻值 (R1max):15Ω(动作后限制电流的高阻态)
  • 动作时间:1.5s(至跳闸状态的参考时间,具体受温度及环境影响)
  • 工作温度:-40℃ ~ +85℃
  • 外形尺寸:长 3.6mm × 宽 1.9mm × 高 1.2mm(1206 封装)
  • 封装:1206,表面贴装,无极性

三、产品特点

  • 自恢复:在过载解除后可自动恢复原始低阻状态,无需更换。
  • 小尺寸:1206 封装,便于高密度 PCB 布局与自动化贴装。
  • 宽电压范围:最高 60V,可用于多种电源环境。
  • 明确的保持/跳闸参数:50mA / 150mA 的阈值适合对小电流信号线与辅助电源的保护。
  • 可靠性:适用于 -40℃ 至 +85℃ 的工业级温度范围。

四、典型应用

  • 通信设备、调制解调器与网关的接口保护
  • 电池管理与移动设备辅助电路保护
  • USB、串口等小电流电源线与信号线防护
  • IoT 终端、传感器模块、安防与监控设备的过流保护
  • LED 驱动中小功率支路的保护

五、选型与使用注意事项

  • 请以保持电流 Ihold(50mA)作为正常工作电流上限的参考,长期工作电流宜低于 Ihold 的 70%~80% 以减少温升和改变量程。
  • 跳闸电流 Itrip(150mA)为动作参考值,实际动作电流受环境温度及 PCB 散热影响,应参考厂方脉冲与时间-电流曲线进行验证。
  • Pd(400mW)表示在给定环境下的最大稳态耗散能力,超过将导致温升并影响动作特性。
  • Imax 标注为 10A,通常指瞬态或冲击容许能力,不能作为连续电流使用依据;具体冲击能力与次数请咨询厂方数据。
  • 布局建议:将元件放置于靠近被保护源头的位置,避免靠近高功率器件并保证良好散热路径。
  • 回流焊:支持常规回流焊工艺,建议遵循 IPC/JEDEC 标准回流曲线,避免长时间高温老化(具体焊接温度与时间请参照厂方工艺说明)。

六、包装与可靠性

  • 封装 1206,适合自动贴片与回流焊接生产线。
  • 适用温度范围与自恢复特性使其在许多工业与民用电子产品中具有良好的长期可靠性。
  • 推荐在设计阶段进行实机验证,结合实际工作温度、散热条件与脉冲特性确认保护性能。

总结:SMD1206P005TF 为一款体积小、可自恢复的过流保护器件,适合 60V 以内、以 50mA 量级为基准的电路保护需求。合理选型与良好 PCB 布局、焊接工艺能确保其在产品中的长期稳定运行。若需详细的时间-电流特性、耐久循环与焊接工艺数据,建议向 RUILON 获取完整数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.