WMSIC Electronic Components

RUILON SMD4532-350NF SMD4532

ModelSMD4532-350NF
Package1812
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD4532-350NF
Type
RUILON
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD4532-350NF
Electronic Component
1
Electronic Component
3.2mm
Package
1812
Electronic Component
2
Electronic Component
(GDT)
Electronic Component
±30%
Electronic Component
0.114g
Electronic Component
4.5mm
Electronic Component
2.7mm
Electronic Component
1
Electronic Component
BM0264921522
Operating Temperature
40℃~+90℃
Capacitor
0.5pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD4532-350NF — 产品概述

一、产品简介

SMD4532-350NF 是 RUILON(瑞隆源)推出的一款双极气体放电管(GDT),采用方形表面贴装封装并以陶瓷管内惰性气体作为放电介质。器件在遭遇过电压尖峰时提供低阻替代通路,借助陶瓷外壳与镍接线端子实现高机械强度与高电流承受能力。该系列特别适合宽带、多媒体与通信设备的输入/输出端口防护,因其极低的关态电容(约0.5 pF),对高带宽信号影响极小,同时该电容值随两端电压变化保持稳定。

主要参数概览:

  • 极数:2 极(双极放电)
  • 直流击穿电压 (Vdc):350 V(±30%)
  • 冲击击穿电压 (Vimp):750 V
  • 脉冲放电电流:2 kA(冲击等级)
  • 极间电容:0.5 pF
  • 工作温度:-40 ℃ ~ +90 ℃
  • 外形尺寸(典型):长度 4.5 mm × 宽度 3.2 mm × 高度 2.7 mm
  • 品牌:RUILON(瑞隆源)
  • 封装形式:方形 SMD(具体封装详细图纸请参见厂家资料)

二、主要特点与优势

  • 低关态电容(≈0.5 pF):适用于以带宽为关键指标的射频、以太网和视频链路等场景,对信号完整性影响极小。
  • 高浪涌承受能力:单次脉冲放电电流可达 2 kA,适合承受雷击或线路感应尖峰。
  • 稳定的击穿特性:直流击穿 350 V(±30%),冲击击穿 750 V,能针对较高幅值暂态进行保护。
  • 表面贴装便于自动插件:方形 SMD 形态利于拾放与回流焊,适合集成到现代 PCB 生产流程。
  • 陶瓷外壳与镍端子:提高机械可靠性、耐热性与导电稳定性。

三、典型应用场景

  • 宽带通信设备(DSL、ADSL、光纤收发终端前端保护)
  • 以太网和 PoE 端口浪涌保护(与低电容需求场合匹配)
  • 卫星、广播、视频传输链路的输入端防护
  • 工业总线与控制系统的接口保护
  • 多媒体设备与消费电子的外部接口(如 HDMI、USB 在特定设计下的保护方案)

四、设计注意要点

  • 放置位置:建议尽量靠近被保护的连接器或电缆入口,缩短放电回路与地线环路,降低寄生感抗。
  • 与 TVS 配合:GDT 响应速度相对较慢,针对快速上升沿的瞬时尖峰,常与低电容 TVS 二极管并联使用——TVS 先钳位短时尖峰,GDT 承担能量并导走高能脉冲。
  • PCB 布局:为降低接地阻抗,放电端应直连至金属接地平面或粗短回流路径;保持放电区域周围的绝缘与爬电距离,以满足系统的安全电压等级。
  • 焊接与回流:器件适用于标准 SMT 回流工艺,但具体回流曲线与焊盘布局请参照 RUILON 官方资料;若为高厚度器件,回流过程中避免过度机械应力。
  • 湿敏与存储:厂方未指明 MSL 等级时,建议按照常规 SMT 元件处理(如有长时间存储或潮湿暴露,建议回流前烘干以防裂纹或焊接缺陷)。

五、可靠性与选型建议

  • 选型时确保器件的直流击穿电压明显高于电路正常工作电压;若系统存在持续高压偏置或较大直流分量,需与厂方确认老化与误触发特性。
  • 对重复性高能冲击的场合,应考虑器件在多次冲击后的性能退化;若系统关键性高,建议做加速寿命或冲击测试验证。
  • 若需要更低电容或更高击穿/冲击能力,可与 RUILON 咨询相邻系列以匹配具体应用需求。

六、采购与后续资料

欲获取完整电气特性曲线、典型脉冲能量曲线、封装图与回流焊工艺规范,请联系 RUILON(瑞隆源)或查阅其官方产品资料/数据手册。对于具体电路整合建议,可提供电路拓扑图与使用环境参数以便进一步优化保护方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.