Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RUILON SMCJ6.5CA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RUILON SMCJ6.5CA
- Type
- RUILON
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RUILON
- Electronic Component
- SMCJ6.5CA
- Electronic Component
- 1
- Package
- SMC(DO-214AB)
- Electronic Component
- Electronic Component
- Type
- TVS
- Electronic Component
- ESD and Surge Protection (TVS / ESD)
- Electronic Component
- 0.398g
- Electronic Component
- 1
- Electronic Component
- BM0264889178
- Operating Temperature
- 55℃~+150℃
- Voltage
- 11.2V
- Current(Ir)
- 500uA
- Voltage(VBR)
- 8.3V
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMCJ6.5CA（RUILON）产品概述
一、产品简介
SMCJ6.5CA 是瑞隆（RUILON）推出的一款双向硅瞬态抑制二极管（TVS），封装为 SMC（DO-214AB）。器件设计用于在瞬态过电压事件中快速钳位，保护敏感电子电路免受浪涌、电磁兼容干扰和雷击脉冲的损害。工作温度范围宽 (-55℃ ~ +150℃)，适用于工业级和严苛环境。
二、主要电气参数
- 极性：双向（适合交流或对称脉冲保护）
- 反向工作电压 Vrwm：6.5V
- 击穿电压 VBR（测试电流）：8.3V
- 钳位电压 Vcl（峰值）：11.2V
- 峰值脉冲电流 Ipp：134A（10/1000μs 波形）
- 峰值脉冲功率 Ppp：1.5kW（10/1000μs 波形）
- 反向漏电流 Ir：≤500μA
- 工作温度：-55℃ ~ +150℃
三、关键特性与优势
- 高浪涌吸收能力：在10/1000μs测试波形下能承受134A冲击电流与1.5kW峰值功率，适合大能量雷击或开关瞬态。
- 双向结构：无需区分极性，可直接用于交流线、差分信号线或两端对称的保护场合。
- 宽温度稳定性：适应高低温工况，可靠性好，适合户外与工业设备。
- 低漏电流与快速响应：在正常工作电压下漏电小，发生瞬态时能迅速钳位，减少被保护器件应力。
四、典型应用场景
- 电源输入与DC总线保护（稳压模块、适配器入口）
- 通信与数据接口防护（DSL、以太网供电侧）
- 工业控制、自动化设备、逆变器与电机驱动的浪涌防护
- 电力设施、路灯与交通控制设备的突波保护
五、封装与可靠性建议
- 封装：SMC (DO-214AB)，适合波峰/回流焊安装，便于散热。
- PCB 布局：器件应靠近入线端或被保护器件的电源入口，采用短且宽的铜箔连接，以降低寄生电感和提升散热。
- 热管理：高能量脉冲时器件发热显著，必要时在PCB上扩展散热铜箔或使用散热垫。
- 并联使用：一般不建议简单并联以增加能量能力，若需提高能量承受，建议选型更高等级的器件或专门并联设计并配对阻抗。
六、选型与使用注意
- 选型时 Vrwm 应略高于系统正常工作电压，避免在正常条件下频繁触发。
- 钳位电压需低于被保护器件可承受的最大电压；SMCJ6.5CA 的典型钳位 11.2V。
- 对于连续或重复高能量脉冲应用，注意器件的热循环与寿命退化，应留有安全裕量并进行实际试验验证。
- 储存与焊接按常规无铅回流工艺要求控制温度曲线，避免长期高温储存影响性能。
SMCJ6.5CA 以其高浪涌吸收能力、双向保护和工业级温度适应性，适用于对瞬态防护有较高要求的电源与接口保护场合。在系统设计中合理布置与选型，可显著提升整机的抗扰度与可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
