Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
RUILON RL0805A390K
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- RUILON RL0805A390K
- Type
- RUILON
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- RUILON
- Electronic Component
- RL0805A390K
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- Varistor Resistor
- Electronic Component
- 200mJ
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Varistor Voltage
- 36V~45V
- Electronic Component
- BM0246666810
- Voltage
- 99V
- Operating Voltage(AC)
- 25V
- Operating Voltage(DC)
- 30V
- Surge Current
- 50A
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RL0805A390K 产品概述
一、产品简介
RL0805A390K 是瑞隆源（RUILON）出品的一款贴片型压敏电阻（SMD MOV），采用0805封装，适用于对体积和焊接工艺有要求的电子产品防护。型号中“390”通常表示标称压敏电压约39V，器件用于抑制浪涌和瞬态过电压，保护敏感电路免受瞬时高压冲击。
二、主要电气参数
- 压敏电压（Varistor Voltage）：36V ~ 45V（典型标称值约39V）
- 钳位电压（Clamping Voltage）：99V（在指定脉冲条件下）
- 工作电压（直流）：30V DC
- 工作电压（交流）：25V AC
- 峰值浪涌电流（Ipp）：50A（单次冲击峰值）
- 能量吸收能力：200 mJ（单次能量）
- 封装：0805（SMD）
三、产品特点
- 小型化封装（0805），便于高密度贴装及自动化回流焊工艺。
- 压敏区间集中，具有快速响应的过压吸收能力，有效限制瞬态电压对后级电路的破坏。
- 钳位电压较低，在浪涌事件时能在较低电压水平下进行钳位，提升保护效果。
- 适用范围广，兼容常见的低压直流与低电压交流系统防护需求。
四、典型应用
- 手机、平板和便携式设备的电源与数据接口保护。
- 通信设备、路由器及机顶盒的端口防雷保护。
- 家电控制板、LED驱动电路以及工业控制模块的瞬态抑制。
- 各类消费电子电源线与信号线的浪涌保护。
五、使用与可靠性注意事项
- 选型时应关注系统最大工作电压与器件的工作电压匹配，避免长期处于接近压敏电压的应力工作点，影响寿命。
- 对于频繁发生高能浪涌的场合，建议在设计中预留余量或采用更高能量等级的压敏元件。
- 贴装过程中请遵循厂家推荐的回流焊温度曲线，避免超温或长时间焊接导致压敏体性能退化。
- 储存与搬运应避免强烈冲击、潮湿及高温环境，防止元件机械或电气特性变化。
六、采购与替代建议
- RL0805A390K 适合需要小封装浪涌保护且冲击能量不大的场景。若系统可能承受更大浪涌（更高Ipp或能量），应考虑更大封装或更高能量等级的MOV。
- 采购时建议向供应商确认批次一致性与电气测试数据（V1mA、V50A 钳位电压测试等），并索取样片进行实际电路验证。
如需进一步的尺寸图、电气波形测试曲线或环境可靠性数据（如温度循环、湿热老化测试），可联系供应商或提供具体应用场景以便给出更精确的选型与布局建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
