WMSIC Electronic Components

RUILON SMD1812P200TF/30 SMD1812P200TF

ModelSMD1812P200TF/30
Package1812
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD1812P200TF / 30
Type
RUILON
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD1812P200TF/30
Electronic Component
1
Electronic Component
3.41mm
Package
1812
Electronic Component
Resettable Fuse
Electronic Component
0.114g
Electronic Component
4.73mm
Electronic Component
1.5mm
Electronic Component
1
Electronic Component
2s
Electronic Component
BM0264254109
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1812P200TF/30 — 微型可复位过流保护器件概述

SMD1812P200TF/30(品牌:RUILON/瑞隆源)是一款面向超便携设备的微型表面贴装可复位过流保护器件(PTC式自恢复保险),采用1812封装,专为空间受限且工作电流较低的应用设计。该器件在正常工作条件下提供低阻抗并在过流时快速升阻以限制电流,复归后可重复使用,适合保护USB、移动电源、无线模块及便携传感器等电路。

一、主要电气参数

  • 最大工作电压 Vmax:30 V
  • 最大浪涌电流 Imax:35 A(短时脉冲)
  • 保持电流 Ihold(典型):2 A(系列范围:0.1 A 至 4.0 A)
  • 跳闸电流 Itrip:4 A
  • 功耗 Pd:800 mW
  • 初始态阻值 Rmin:20 mΩ(低阻以减小压降)
  • 跳断后阻值 R1max:100 mΩ(限制故障电流)
  • 动作时间:约 2 s(达到跳闸阈值所需时间)
  • 工作温度:-40 ℃ ~ +85 ℃

二、主要特性与优点

  • 微型1812封装,节省电路板空间,便于自动贴装与回流焊工艺。
  • 低初始阻值,有助于降低静态功耗和发热,保障电路效率。
  • 可复位设计支持多次动作恢复,无需更换元件,降低维护成本。
  • 宽温工作范围,适应工业级与消费类环境。
  • 对短时浪涌有良好承受能力,可应对插拔、瞬态冲击等场景。

三、典型应用场景

  • 移动电源、便携充电器与USB供电线路保护。
  • 智能手持终端、可穿戴设备及小型通信模块。
  • 低压传感器阵列、物联网节点电源保护。
  • 电池管理与备用电源回路的过流保护。

四、安装与选用建议

  • 建议靠近被保护电源线侧侧贴装,最短连接以减小旁路路径。
  • 根据系统最大持续电流与启动浪涌特性,选择合适的Ihold等级;本型号Ihold=2A、Itrip=4A,若系统静态电流接近保持电流,应选择更高等级。
  • 注意器件在长期工作下会有温度升高,留出足够的PCB散热面积,避免邻近高温元件。
  • 对于有严格压降要求的场合,计算在保持态下的电压降(Ihold × Rmin)以确保满足系统电压裕量。

五、封装与机械信息

  • 封装:1812(美标)
  • 尺寸(典型):长 4.73 mm × 宽 3.41 mm × 高 1.50 mm
  • 适配SMT贴装和回流焊流程,推荐遵循厂商提供的焊接曲线与回流温度规范。

六、可靠性与测试注意

  • 建议在最终应用环境下进行热循环与寿命验证,确认在最大工作电压与实际电流下的稳态温升与动作特性。
  • 对于频繁有大幅电流波动的场合,评估长期重复跳闸对器件参数漂移的影响,必要时增加冗余或选择额定更高的型号。

七、选型与采购提示

  • 本系列提供从0.1 A到4.0 A不同保持电流的型号,请根据实际负载选择合适Ihold等级,本件为SMD1812P200TF/30(Ihold=2 A,Itrip=4 A)。
  • 订购时确认封装、工作电压与浪涌能力满足系统需求,向供应商索取完整数据手册与焊接指南以便设计验证。

如需对应的电气特性曲线、温升测试报告或PCB布局参考图,可提供后续资料支持与样品测试建议。

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