WMSIC Electronic Components

RUILON RLS102-501M RLS102

ModelRLS102-501M
PackageElectronic Component
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON RLS102-501M
Type
RUILON
Minimum package
2000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
RLS102-501M
Electronic Component
1
Package
Electronic Component
Capacitor
1pF
Electronic Component
Electronic Component
Electronic Component
0.22g
Electronic Component
1
(φD)
2.6mm
Voltage
500V
Electronic Component
BM0264921511
Operating Temperature
45℃~+85℃
Surge Current
1kA
Resistor
100MΩ
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RLS102-501M 瞬态过压保护器件产品概述

RLS102-501M是RUILON(瑞隆源)推出的一款轴向引线封装瞬态过压保护器件,针对小型化电路的浪涌防护需求设计,具备宽温适应、低电容、高浪涌耐受等核心特性,可广泛应用于智能家居、通信模块、工业传感器等场景。

一、产品核心定位与应用价值

该器件的核心定位是小型化电路的低成本浪涌防护解决方案,聚焦解决常见过压问题:

  • 抵御雷电感应、开关浪涌(如家电启停、电机切换)等瞬时高压冲击;
  • 保护敏感电子元件(如MCU、传感器、通信芯片)免受过压损坏;
  • 体积小巧适配紧凑PCB布局,同时满足宽温环境的可靠性要求。

二、关键技术参数深度解析

RLS102-501M的参数设计平衡了防护性能与电路兼容性,核心参数如下:

1. 击穿电压与精度

击穿电压标称500V,精度±20%,实际触发范围为400V~600V。这一设计既避免了因精度过高导致的“误触发”(正常电压波动下不动作),又能在过压达到保护阈值时快速导通,将电压钳位在安全范围。

2. 绝缘电阻与漏电流

正常工作状态下绝缘电阻≥100MΩ,在500V偏置电压下,漏电流仅约5μA(计算值:I=V/R=500V/100MΩ)。低漏电流特性可防止对敏感电路(如低功耗MCU、模拟传感器)造成干扰,不影响电路正常功能。

3. 低电容特性

电容标称1pF,属于高频兼容型设计。在通信模块(如蓝牙、WiFi)的信号端口应用中,低电容不会导致信号衰减或相位偏移,确保数据传输稳定。

4. 浪涌耐受能力

可承受1kA(8/20μs波形) 的单次浪涌脉冲,能有效抵御常见浪涌场景(如家庭电网的开关浪涌、户外设备的雷电感应)。多次浪涌测试后,器件性能无明显衰减,可靠性符合工业级要求。

5. 宽温与体积适配

工作温度范围为**-45℃~+85℃**,覆盖从低温户外(如北方冬季)到高温工业控制柜(内部环境温度)的场景;轴向引线封装直径仅2.6mm,长度紧凑,适合小型化产品(如智能手环充电模块、小型传感器)的集成。

三、封装与可靠性设计亮点

1. 轴向引线封装优势

采用标准轴向引线封装,引脚焊接方便,适配传统插装工艺;直径2.6mm的紧凑体积,可在PCB上实现高密度布局,无需额外占用过多空间。

2. 材料与工艺可靠性

RUILON采用高稳定性陶瓷基材料,器件内部结构牢固;引线与主体的焊接工艺经老化测试验证,可承受多次温度循环与机械振动,适合批量应用于对可靠性要求较高的领域。

四、典型应用场景推荐

RLS102-501M的参数特性使其适配多种小型化电路:

  1. 智能家居设备:智能插座、开关面板的电源端口防护,抵御家电开关浪涌;
  2. 小型通信模块:蓝牙耳机、WiFi模块的充电/信号端口,低电容不影响数据传输;
  3. 工业传感器:温度、压力传感器的信号端,宽温适应工业现场环境;
  4. 小型家电:手机充电器、加湿器的电源防护,体积小巧适配紧凑设计。

五、选型与使用注意事项

  1. 选型匹配:需确保电路正常工作电压远低于击穿电压下限(400V),避免器件误动作;
  2. 焊接要求:焊接温度≤260℃,单次焊接时间≤3秒,防止高温损坏内部结构;
  3. 并联扩容:若浪涌需求超过1kA,可采用多个器件并联(需注意均流);
  4. 存储条件:常温干燥环境(湿度≤60%)存储,避免引脚氧化影响绝缘性能。

综上,RLS102-501M凭借小型化、宽温、低电容与高浪涌耐受的综合优势,成为小型电子设备过压防护的高性价比选择,适合对成本与体积敏感的应用场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.