WMSIC Electronic Components

RUILON SMD2018P100TF/33 SMD2018P100TF

ModelSMD2018P100TF/33
Package2018
BrandRUILON
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
RUILON SMD2018P100TF / 33
Type
RUILON
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
RUILON
Electronic Component
SMD2018P100TF/33
Electronic Component
1
Electronic Component
4.93mm
Package
2018
Electronic Component
Resettable Fuse
Electronic Component
0.095g
Electronic Component
5.44mm
Electronic Component
1.2mm
Electronic Component
1
Electronic Component
400ms
Electronic Component
BM0264391828
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
1.1W

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD2018P100TF/33 — 表面贴装自恢复过流保护器件产品概述

SMD2018P100TF/33 为 RUILON(瑞隆源)旗下 2018 系列的一款表面贴装自恢复(PTC)过流保护器件。该器件针对需要较高保持电流并且工作电压较高的电源线路提供过流防护,支持在过载解除后自动恢复导通,适合消费电子、通信、电源模块等领域的短路/过流保护应用。

一 性能亮点

  • 耐压(Vmax):33 V,适配中低电压直流线路保护。注:2018 系列有部分型号可支持更高电压,具体以型号为准。
  • 最大电流(Imax):35 A,能够承受瞬时短路或过载情形下的冲击电流。
  • 保持电流(Ihold):1.1 A,器件在此电流以下保持低阻态持续导通。
  • 跳闸电流(Itrip):2.2 A,达到或超过此电流时器件进入高阻限流态以保护电路。
  • 功耗(Pd):1.1 W(额定条件),反映器件在稳态下的热承受能力。
  • 初始态阻值(Rmin):60 mΩ,提供较低的额定导通电阻以减少正常工作时的能耗。
  • 跳断后阻值(R1max):360 mΩ,过流后显著增阻以限制电流。
  • 动作时间:约 400 ms(典型或测试条件),用于评估器件响应速度。
  • 工作温度范围:-40℃ 至 +85℃,适用于常见环境温度条件。

二 机械与封装信息

  • 外形尺寸:长 5.44 mm × 宽 4.93 mm × 高 1.20 mm,符合小尺寸 SMD 布局要求。
  • 封装:表面贴装型(2018 规格类),具体封装结构与焊盘布局建议以厂商数据手册为准(当前信息为“未知”项,应向供应商确认完整封装图纸与回流焊工艺参数)。

三 典型应用场景

  • USB/外围设备电源保护(符合 5~20 V 级别电源系统,注意电压限制)。
  • 通信设备与路由器的供电总线保护。
  • 电池供电/移动设备的输入短路与过流防护(需确认系统最大工作电压)。
  • 电源模块、适配器输出保护与版上多路电源分支保护。

四 设计与使用建议

  • 工作电压应严格不超过标称耐压 33 V;若系统电压接近或超过该值,请选择耐压更高型号。
  • 选型时留有裕量:为避免误动作,推荐在 Ihold 之下运行留有安全余量;若常态电流接近 Ihold,应提升至更高 Ihold 的型号。
  • 热设计:Pd(1.1 W)为器件在规定工况下的热输入能力。版上应保证良好散热条件,避免器件长期在高温环境下工作导致参数漂移或寿命降低。
  • 布局建议:器件两侧焊盘要保证良好导热路径,与热敏元件或温度源保持适当间距。避免在器件正下方放置大面积铜或热孔以致回流不良,具体焊盘尺寸以厂商推荐为准。
  • 测试与验证:在实际应用中应进行上电试验、过流/短路模拟测试,并在目标环境温度下验证动作时间与恢复性能。

五 储存与焊接注意事项

  • 遵循一般 SMD 元件回流焊工艺,避免超过器件耐温极限。若无厂方回流曲线,建议使用标准无铅回流曲线,并先进行小批量工艺验证。
  • 储存环境避免高湿、高温,未使用时保持干燥包装,必要时采用再流焊前干燥处理。

六 选型与替代参考

  • 若系统电压或持续电流高于本型号范围,应优先选择耐压更高或 Ihold 更大的同系列型号。
  • 对于对响应时间或最大承受短路电流有更高要求的方案,可参考同厂或同行业评分更高的快动作 PPTC 产品。
  • 在无法确定封装与详细数据时,联系 RUILON(瑞隆源)获取完整数据手册、过流曲线(I-T)、热阻与焊盘推荐图。

总结:SMD2018P100TF/33 针对需要自恢复过流保护且保持电流约 1.1 A 的中低电压应用提供了紧凑的 SMD 方案。项目选型时,请结合实际工作电压、持续电流、瞬时短路能力及热管理要求,参考厂方完整数据表与应用建议以确保可靠性。

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